Description
Instructor(s)/Supervisor(s)/Coordinator(s): Khawar SARFRAZThe class is designed to provide students with an experience of the complete IC design process in the industry from product definition to production and measurement. Taking a product in the market as an example, students are going to re-design the chip all the way from system definition, protocol design, selecting technology, installing technology file, digital building block design, analog building block design, digital analogy integration, ESD protection, post-design simulation, and tape out process. After that, the students will perform on-wafer testing, failure analysis, package selection, PCB design, test vector generation, reliability screening, ESD testing and data-sheet writing. Students completing this class are expected to have the equivalent experience of completing a full IC design cycle in the industry. May be graded PP.