Projects per year
Personal profile
Research interests
Electronic & Computer Engineering - Emerging AI Chip Design
Electronic & Computer Engineering - Cross-Stack AI System Design
Electronic & Computer Engineering - Computing-In-Memory
Electronic & Computer Engineering - Reconfigurable Computing
Electronic & Computer Engineering - Cross-Stack AI System Design
Electronic & Computer Engineering - Computing-In-Memory
Electronic & Computer Engineering - Reconfigurable Computing
Position Held
Associate Director of Institute of Integrated Circuits and Systems
Associate Director of HKUST and Intel Joint Laboratory
Associate Director of HKUST and Intel Joint Laboratory
Related documents
Education/Academic qualification
PhD in Electronic Science and Technology, PhD, Tsinghua University
2019
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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SDG 7 Affordable and Clean Energy -
SDG 9 Industry, Innovation, and Infrastructure -
SDG 12 Responsible Consumption and Production
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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Development of Energy-Efficient Edge-Side Chip for Collaborative "Cerebellum-Cerebrum" Computing in Embodied intelligence
LI, C. (CoI), XU, C. (CoI), YU, H. (CoI), ZHU, Z. (CoI), TU, F. (CoI), LIU, O. (CoI) & XIE, Y. (CoI)
1/01/26 → 31/12/28
Project: Research
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Intelligent and Agile Integrated Circuit Design Methodologies Based on Circuit Foundation Models
GENG, Y. (Team member), REN, M. H. (Team member), XIE, Z. (PI), TU, F. (CoPI), HE, J. (CoPI), XU, Q. (CoPI) & CHENG, K.-T. T. (CoPI)
RGC - Collaborative Research Fund
1/06/25 → 31/05/28
Project: Research
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Computing-In-Memory Artificial Intelligence Processor Design
TU, F. (PI)
National Natural Science Foundation of China
1/01/25 → 31/12/27
Project: Research
Research output
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A 14.08-to-135.69Token/s ReRAM-on-Logic Stacked Outlier-Free Large-Language-Model Accelerator with Block-Clustered Weight-Compression and Adaptive Parallel-Speculative-Decoding
Dong, P., Tan, Y., Liu, X., Luo, P., Liu, Y., Pang, D., Ma, S., Huang, X., Liu, S. Y., Zhang, D., Lu, Z., Liang, L., Tsui, C. Y., Tu, F., Zhao, L. & Cheng, K. T., 3 Mar 2026, 2026 IEEE International Solid-State Circuits Conference, ISSCC 2026. Institute of Electrical and Electronics Engineers Inc., p. 532-534 3 p. 11409211. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 69).Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review
3 Link opens in a new tab Citations (Scopus) -
A 28nm 44.15TFLOPS/W and 1.57TFLOPS/mm2 Joint-Alignment Floating-Point CIM Macro with ISO26262 ASIL-D Safety Level for Autonomous Driving
He, Z., Wang, Y., Yue, Z., Wu, Z., Hu, Y., Tu, F. & Yin, S., 3 Jul 2026, 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2026. Institute of Electrical and Electronics Engineers Inc., 3 p. 11577409. (Digest of Technical Papers - Symposium on VLSI Technology).Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review
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A Full-Digital Heterogeneous Computing-in-Memory With Dual-Bit Serialized Weight Stream and Ping-Pong Computing for Efficient Transformer Acceleration
Wang, D., Xu, L., Yuan, S., He, W., He, G., Tu, F., Li, X. & Sun, Y., 27 May 2026, (E-pub ahead of print) In: IEEE Transactions on Circuits and Systems I: Regular Papers. p. 1-14 14 p., 11535964.Research output: Contribution to journal › Journal Article › peer-review
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Bridging Efficiency and Scalability in Llm System Via 3D Hybrid Pim With 2D in-Transit Computation
Li, H., Ma, S., Qu, H., Zhang, W., Chen, J., Lin, J., Tu, F. & Zhao, R., 4 Aug 2026, 2026 ACM/IEEE 53rd Annual International Symposium on Computer Architecture, ISCA 2026. Institute of Electrical and Electronics Engineers Inc., p. 2615-2631 17 p. 11617417. (Proceedings - International Symposium on Computer Architecture).Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review
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D2CIM: A 28nm 53.3 TFLOPS/W Decoding Digital CIM Macro for Efficient FlashMLA-based LLM Inference
Chen, J., XUAN, Z., LI, Y., YAN, Z., LI, Z., YUNG, Y.-F., DENG, Y., HUO, X., TSUI, C. Y., CHENG, K.-T. T. & TU, F., 13 May 2026, 2026 IEEE Custom Integrated Circuits Conference, CICC 2026 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 4 p. 11509467. (Proceedings of the Custom Integrated Circuits Conference).Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review
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IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD) (Journal)
TU, F. (Reviewer)
1 Mar 2026 → …Activity: Publication peer-review and editorial work › Editorial work
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Computing-in-Memory Processor for Large-Scale AI Models
TU, F. (Invited speaker)
Nov 2025Activity: Talk or presentation › Invited
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Computing-in-Memory Processor for Large-Scale AI Models
TU, F. (Invited speaker)
Oct 2025Activity: Talk or presentation › Invited
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Computing-in-Memory Processor for Large-Scale AI Models
TU, F. (Invited speaker)
Oct 2025Activity: Talk or presentation › Invited
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Computing-in-Memory Processor for Large-Scale AI Models
TU, F. (Invited speaker)
Apr 2025Activity: Talk or presentation › Invited
Awards
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Gold Medal with Congratulations of the Jury at the 50th International Exhibition of Inventions Geneva
TU, F. (Recipient), 12 Apr 2025
Prize: Honorary Award
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MIT Technology Review “Innovators Under 35” (TR35) Asia-Pacific
TU, F. (Recipient), 22 Sept 2025
Prize: Honorary Award
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Nomination Award for 2024 Top-10 Research Advances in China Semiconductors
TU, F. (Recipient), Jan 2025
Prize: Honorary Award
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2023 Top-10 Research Advances in China Semiconductors
TU, F. (Recipient), Feb 2024
Prize: Honorary Award
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