Skip to main navigation
Skip to search
Skip to main content
The Hong Kong University of Science and Technology Home
Home
Profiles
Research units
Research output
Projects
Awards
Activities
Press/Media
Courses
Student theses
Datasets
Impacts
Search by expertise, name or affiliation
Outstanding Sustained Technical Contribution Award
LEE, Shi-wei (Recipient)
Department of Mechanical and Aerospace Engineering
Prize
:
Honorary Award
Awarded date
May 2020
Granting Organisations
IEEE Electronics Packaging Society
X