Project Details
Chinese Project Title
用於異質性整合的高精度磨片機和鍵合機
| Status | Finished |
|---|---|
| Effective start/end date | 1/06/21 → 31/05/24 |
A High-accuracy Wafer Polisher and Bonders for Heterogeneous Integration
- CHAI, Yang (CoPI)
- HAO, Jianhua (CoPI)
- CHOI, Hoi Wai (CoPI)
- LAI, Pui-to (CoPI)
- ZHANG, Xuming (CoPI)
- SRIVASTAVA, Abhishek Kumar (CoPI)
- POON, Andrew Wing On (PI)
- CHEN, Kevin Jing (CoPI)
- LAU, Kei May (CoPI)
- YOBAS, Levent (CoPI)
- WONG, Man (CoPI)
- FAN, Zhiyong (CoPI)
- YU, Hongyu (CoPI)
- CHAN, Man Sun (CoPI)
- QIU, Huihe (CoPI)
- YE, Wenjing (CoPI)
- LEE, Yi-Kuen (CoPI)
- LI, Zhigang (CoPI)
- LEE, Ricky Shi-wei (CoPI)
- TANG, Wing Man (CoPI)
- SUN, Xiankai (CoPI)
Project: Research