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Advanced Packaging Materials for Optoelectronic Devices

  • HO, Paul (CoI)
  • YU, Yong (CoI)
  • CHAN, Chung Pui (CoI)
  • LEUNG, Lai To (CoI)
  • NG, Ka Ming (CoI)
  • WONG, Ka Wai (CoI)

Project: Research

Project Details

Chinese Project Title

用於光電設備的先進封裝材料
StatusFinished
Effective start/end date1/08/1631/01/18

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