Design a low sintering temperature copper pastes using bimodal particles for thick film fabrication

LAM, Henry Hei Ning (PI)
NG, Ka Ming (CoI)

Department of Chemical and Biological Engineering

Project: Research

Chinese Project Title

開發含有雙峰分佈銅粉的低燒結厚膜銅漿

Status	Finished
Effective start/end date	1/07/17 → 31/12/19

Formulation of a paste for copper thick film
Tang, J., Mak, C. H. H., Tam, S. K. & Ng, K. M., Aug 2021, In: Journal of Nanoparticle Research. 23, 8, 166.
Research output: Contribution to journal › Journal Article › peer-review
13 Link opens in a new tab Citations (Scopus)