Project Details
Chinese Project Title
应用于高频高速传输的LCP电路基板制作技术开发
| Status | Finished |
|---|---|
| Effective start/end date | 1/04/18 → 31/03/20 |
Fingerprint
Explore the research topics touched on by this project. These labels are generated based on the underlying awards/grants. Together they form a unique fingerprint.