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Molecular Design of High Temperature, High Toughness Epoxy Resin for Electronic Industry Application

  • LIN, Jen Tsung (CoI)
  • WEN, Haoran (CoI)
  • LU, Jianbiao (CoI)
  • HUANG, Baoling (PI)
  • YUEN, Ming Fai (CoI)

Project: Research

Project Details

Chinese Project Title

電子工業用高溫高韌環氧樹脂分子工程改性的研究
StatusFinished
Effective start/end date1/01/1731/12/18

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