Monolithic Hetero-integration of Third Generation Semiconductor GaN- and AlScN-based Microsystem Chip for RF Application

YANG, Yansong (PI)
ZHENG, Zheyang (CoI)

Department of Electronic and Computer Engineering

Project: Research

Chinese Project Title

基於第三代半導體氮化鎵和氮化鈧鋁異質集成射頻微系統芯片研究

Status	Finished
Effective start/end date	1/12/23 → 30/11/25

Sealed-Cavity Bulk Acoustic Resonator for Subsequent Fabrication and Higher Order Mode
Xu, J., Liu, Z., Zheng, J., Qian, F., Wong, M. & Yang, Y., 1 Feb 2024, In: Journal of Microelectromechanical Systems. 33, 1, p. 3-5 3 p.
Research output: Contribution to journal › Journal Article › peer-review
6 Link opens in a new tab Citations (Scopus)