Skip to main navigation Skip to search Skip to main content

Overcoming Technical Limits of Copper Hybrid Bonding for Advanced Three-Dimensional Integrated Circuits

Project: Research

Project Details

Chinese Project Title

突破先進三維集成電路之銅混合鍵合技術瓶頸
StatusActive
Effective start/end date1/11/2331/10/28

Fingerprint

Explore the research topics touched on by this project. These labels are generated based on the underlying awards/grants. Together they form a unique fingerprint.