Research on the Mechanism of Low-Temperature Low-Pressure Transient All-Cu Interconnect through Spark Ablation for Ultra-Fine Pitch Semiconductor Packaging

LI, Zhigang (CoI)

HKUST Fok Ying Tung Research Institute

Project: Research

Chinese Project Title

面向超细节距半导体全铜封装的火花烧蚀低温低压瞬态互连机理研究

Status	Finished
Effective start/end date	1/01/22 → 31/12/25