A Highly Sensitive 3-Axis Micro Search-Coil Magnetometer enabled by High-Density Through-Silicon-Via Process

Hadi Tavakkoli; Mingzheng Duan; Longheng Qi; Izhar; Xu Zhao; Yi Kuen Lee

doi:10.1109/MEMS49605.2023.10052451

A Highly Sensitive 3-Axis Micro Search-Coil Magnetometer enabled by High-Density Through-Silicon-Via Process

Hadi Tavakkoli, Mingzheng Duan, Longheng Qi, Izhar, Xu Zhao, Yi Kuen Lee^*

^*Corresponding author for this work

Department of Mechanical and Aerospace Engineering

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

1 Citation (Scopus)

Abstract

We report a highly sensitive 3-axis micro search-coil magnetometer (μSCM) fabricated in one single silicon die and enabled by an in-house developed through-silicon-via (TSV) process. The z-axis μSCM is realized by two planar spiral inductors on both sides of the silicon wafer. The x & y-axis μSCMs are realized inside a silicon wafer by 400 TSVs (an array of 20×20 TSVs with a diameter of 50 μm) for each axis. A conformal polysilicon deposition is utilized to achieve an electrical connection through the etch holes inside the silicon wafer. Although partial filling of TSVs with polysilicon has higher resistance (< 3Ω per TSV) compared to complete filling, the proposed fabrication method is simpler and free of grinding and polishing steps, making it a more cost-effective alternative. The sensitivity (S) of the 3-axis μSCM (Sx & Sy = 134 mV/mT, Sz = 3130 mV/mT at 100Hz) is better than existing μSCMs (13 mV/mT) by more than one order of magnitude.

Original language	English
Title of host publication	2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1095-1098
Number of pages	4
ISBN (Electronic)	9781665493086
DOIs	https://doi.org/10.1109/MEMS49605.2023.10052451
Publication status	Published - 2023
Event	36th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2023 - Munich, Germany Duration: 15 Jan 2023 → 19 Jan 2023

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume	2023-January
ISSN (Print)	1084-6999

Conference

Conference	36th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2023
Country/Territory	Germany
City	Munich
Period	15/01/23 → 19/01/23

Bibliographical note

Publisher Copyright:
© 2023 IEEE.

Keywords

3-axis search-coil magnetometer
MEMS
planar spiral inductor
through silicon via (TSV)

Access to Document

10.1109/MEMS49605.2023.10052451

Cite this

Tavakkoli, H., Duan, M., Qi, L., Izhar, Zhao, X., & Lee, Y. K. (2023). A Highly Sensitive 3-Axis Micro Search-Coil Magnetometer enabled by High-Density Through-Silicon-Via Process. In 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023 (pp. 1095-1098). (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2023-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMS49605.2023.10052451

Tavakkoli, Hadi ; Duan, Mingzheng ; Qi, Longheng et al. / A Highly Sensitive 3-Axis Micro Search-Coil Magnetometer enabled by High-Density Through-Silicon-Via Process. 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023. Institute of Electrical and Electronics Engineers Inc., 2023. pp. 1095-1098 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

@inproceedings{6985cb9faf074465a02d0d2b1058151f,

title = "A Highly Sensitive 3-Axis Micro Search-Coil Magnetometer enabled by High-Density Through-Silicon-Via Process",

abstract = "We report a highly sensitive 3-axis micro search-coil magnetometer (μSCM) fabricated in one single silicon die and enabled by an in-house developed through-silicon-via (TSV) process. The z-axis μSCM is realized by two planar spiral inductors on both sides of the silicon wafer. The x \& y-axis μSCMs are realized inside a silicon wafer by 400 TSVs (an array of 20×20 TSVs with a diameter of 50 μm) for each axis. A conformal polysilicon deposition is utilized to achieve an electrical connection through the etch holes inside the silicon wafer. Although partial filling of TSVs with polysilicon has higher resistance (< 3Ω per TSV) compared to complete filling, the proposed fabrication method is simpler and free of grinding and polishing steps, making it a more cost-effective alternative. The sensitivity (S) of the 3-axis μSCM (Sx \& Sy = 134 mV/mT, Sz = 3130 mV/mT at 100Hz) is better than existing μSCMs (13 mV/mT) by more than one order of magnitude.",

keywords = "3-axis search-coil magnetometer, MEMS, planar spiral inductor, through silicon via (TSV)",

author = "Hadi Tavakkoli and Mingzheng Duan and Longheng Qi and Izhar and Xu Zhao and Lee, \{Yi Kuen\}",

note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 36th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2023 ; Conference date: 15-01-2023 Through 19-01-2023",

year = "2023",

doi = "10.1109/MEMS49605.2023.10052451",

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series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

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Tavakkoli, H, Duan, M, Qi, L, Izhar, Zhao, X & Lee, YK 2023, A Highly Sensitive 3-Axis Micro Search-Coil Magnetometer enabled by High-Density Through-Silicon-Via Process. in 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023. Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), vol. 2023-January, Institute of Electrical and Electronics Engineers Inc., pp. 1095-1098, 36th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2023, Munich, Germany, 15/01/23. https://doi.org/10.1109/MEMS49605.2023.10052451

A Highly Sensitive 3-Axis Micro Search-Coil Magnetometer enabled by High-Density Through-Silicon-Via Process. / Tavakkoli, Hadi; Duan, Mingzheng; Qi, Longheng et al.
2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023. Institute of Electrical and Electronics Engineers Inc., 2023. p. 1095-1098 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2023-January).

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

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AU - Izhar,

AU - Zhao, Xu

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N2 - We report a highly sensitive 3-axis micro search-coil magnetometer (μSCM) fabricated in one single silicon die and enabled by an in-house developed through-silicon-via (TSV) process. The z-axis μSCM is realized by two planar spiral inductors on both sides of the silicon wafer. The x & y-axis μSCMs are realized inside a silicon wafer by 400 TSVs (an array of 20×20 TSVs with a diameter of 50 μm) for each axis. A conformal polysilicon deposition is utilized to achieve an electrical connection through the etch holes inside the silicon wafer. Although partial filling of TSVs with polysilicon has higher resistance (< 3Ω per TSV) compared to complete filling, the proposed fabrication method is simpler and free of grinding and polishing steps, making it a more cost-effective alternative. The sensitivity (S) of the 3-axis μSCM (Sx & Sy = 134 mV/mT, Sz = 3130 mV/mT at 100Hz) is better than existing μSCMs (13 mV/mT) by more than one order of magnitude.

AB - We report a highly sensitive 3-axis micro search-coil magnetometer (μSCM) fabricated in one single silicon die and enabled by an in-house developed through-silicon-via (TSV) process. The z-axis μSCM is realized by two planar spiral inductors on both sides of the silicon wafer. The x & y-axis μSCMs are realized inside a silicon wafer by 400 TSVs (an array of 20×20 TSVs with a diameter of 50 μm) for each axis. A conformal polysilicon deposition is utilized to achieve an electrical connection through the etch holes inside the silicon wafer. Although partial filling of TSVs with polysilicon has higher resistance (< 3Ω per TSV) compared to complete filling, the proposed fabrication method is simpler and free of grinding and polishing steps, making it a more cost-effective alternative. The sensitivity (S) of the 3-axis μSCM (Sx & Sy = 134 mV/mT, Sz = 3130 mV/mT at 100Hz) is better than existing μSCMs (13 mV/mT) by more than one order of magnitude.

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BT - 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023

PB - Institute of Electrical and Electronics Engineers Inc.

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ER -

Tavakkoli H, Duan M, Qi L, Izhar, Zhao X, Lee YK. A Highly Sensitive 3-Axis Micro Search-Coil Magnetometer enabled by High-Density Through-Silicon-Via Process. In 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023. Institute of Electrical and Electronics Engineers Inc. 2023. p. 1095-1098. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). doi: 10.1109/MEMS49605.2023.10052451

A Highly Sensitive 3-Axis Micro Search-Coil Magnetometer enabled by High-Density Through-Silicon-Via Process

Abstract

Publication series

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Bibliographical note

Keywords

Access to Document

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