A multi-scale model for cell adhesion and deformation

Narcisse N'dri, Wei Shyy, Roger Tran-Son-Tay, H. S. Udaykumar

Research output: Chapter in Book/Conference Proceeding/ReportConference Paper published in a bookpeer-review

4 Citations (Scopus)

Abstract

A multi-scale computational approach for studying the adhesion kinetics and deformation of a cell on a substrate is presented. This method breaks the computational work into two separate but interrelated domains. At the cellular level, a continuum model satisfying the field equations for momentum transfer and mass continuity is adopted. At the receptor-ligand or molecular level, the bond force is mechanically represented by a spring, and the formation and dissociation of bonds are characterized by a reversible two-body kinetic model. The model demonstrates that as the reverse reaction rate increases, the receptor-ligand bonds break faster, and the opposite is observed when the forward reaction rate increases. As expected, the cell peeling time increases as the number of ligands increases until it equals the number of receptors. The peeling time becomes shorter when the spring constant or slippage constant is larger. Furthermore, as the cell velocity increases during the peeling process, the maximum bond length increases while the total peeling time decreases. Based on the information from the two modeling levels, dynamics of membrane movement can be computed, illustrating that the cell mechanical properties and surrounding fluid dynamics affect the receptor-ligand kinetics, and that these effects need to be included in any realistic cell-surface interaction models.

Original languageEnglish
Title of host publicationFluids Engineering
PublisherAmerican Society of Mechanical Engineers (ASME)
Pages205-213
Number of pages9
ISBN (Electronic)9780791819258
DOIs
Publication statusPublished - 2000
Externally publishedYes
EventASME 2000 International Mechanical Engineering Congress and Exposition, IMECE 2000 - Orlando, United States
Duration: 5 Nov 200010 Nov 2000

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Volume2000-R

Conference

ConferenceASME 2000 International Mechanical Engineering Congress and Exposition, IMECE 2000
Country/TerritoryUnited States
CityOrlando
Period5/11/0010/11/00

Bibliographical note

Publisher Copyright:
© 2000 by ASME.

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