Abstract
A bilayer beam model is extended to study the fracture behavior of dielectric interfacial cracks. In this model, a semi-infinite crack with an original opening value is oriented along the interface between two dielectric layers which are under mechanical/electrical loading. Taking into account the effect of the electrostatic traction on the interfacial crack, a nonlinear analytical solution is derived, along with also a developed finite element analysis method where a special constitutive equation for the capacitor element in ANSYS is utilized to simulate the electrostatic tractions. Both the analytical and numerical solutions predict the same results which further show that the elastic and dielectric mismatches can play a significant role in the interfacial cracking behavior under mechanical and electrical loading. Furthermore, the electrostatic tractions may cause hysteresis loops in the curve of crack opening versus applied mechanical displacement or versus applied electric voltage. An applied mechanical load is the driving force for the interfacial cracking, while an applied electric field retards it.
| Original language | English |
|---|---|
| Pages (from-to) | 47-58 |
| Number of pages | 12 |
| Journal | International Journal of Fracture |
| Volume | 188 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - Jul 2014 |
Keywords
- Bilayer beam model
- Dielectric bimaterials
- Electrostatic traction
- Interfacial fracture
- Nonlinear analytical solution
- TRANS126 element
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