A Silicon Molded Metal Transfer Process for On-Chip Suspended Power Inductors

Yixiao DIng; Xiangming Fang; Rongxiang Wu; Qili Guo; Johnny K.O. Sin

doi:10.1109/transducers.2019.8808586

A Silicon Molded Metal Transfer Process for On-Chip Suspended Power Inductors

Yixiao DIng
, Xiangming Fang
, Rongxiang Wu
, Qili Guo
, Johnny K.O. Sin

Department of Electronic and Computer Engineering

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

2 Citations (Scopus)

Abstract

In this paper, a novel silicon molded metal transfer process is developed to build on-chip suspended thick-winding inductors for high-frequency power management applications. In the proposed process, a silicon mold wafer coated with a heat-depolymerizable sacrificial layer is fabricated and used as the electroplating mold for thick-winding inductors formation; a simple transfer process is developed to release the inductors from the mold wafer and integrate the inductors with power IC chips. On-chip suspended power inductors with 65 μm thick windings are fabricated. The increased winding thickness leads to a more than 3 times reduction in DC resistance compared with inductors built by other suspended inductors fabrication techniques.

Original language	English
Title of host publication	2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	142-145
Number of pages	4
ISBN (Electronic)	9781728120072
DOIs	https://doi.org/10.1109/transducers.2019.8808586
Publication status	Published - Jun 2019
Event	20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII - Berlin, Germany Duration: 23 Jun 2019 → 27 Jun 2019

Publication series

Name	2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII

Conference

Conference	20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
Country/Territory	Germany
City	Berlin
Period	23/06/19 → 27/06/19

Bibliographical note

Publisher Copyright:
© 2019 IEEE.

Keywords

power integrated circuits.
silicon mold
Suspended inductor
thick winding

Access to Document

10.1109/transducers.2019.8808586

Cite this

DIng, Y., Fang, X., Wu, R., Guo, Q., & Sin, J. K. O. (2019). A Silicon Molded Metal Transfer Process for On-Chip Suspended Power Inductors. In 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII (pp. 142-145). Article 8808586 (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/transducers.2019.8808586

DIng, Yixiao ; Fang, Xiangming ; Wu, Rongxiang et al. / A Silicon Molded Metal Transfer Process for On-Chip Suspended Power Inductors. 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 142-145 (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII).

@inproceedings{e50e83456a71469cbdb48d373f63e61d,

title = "A Silicon Molded Metal Transfer Process for On-Chip Suspended Power Inductors",

abstract = "In this paper, a novel silicon molded metal transfer process is developed to build on-chip suspended thick-winding inductors for high-frequency power management applications. In the proposed process, a silicon mold wafer coated with a heat-depolymerizable sacrificial layer is fabricated and used as the electroplating mold for thick-winding inductors formation; a simple transfer process is developed to release the inductors from the mold wafer and integrate the inductors with power IC chips. On-chip suspended power inductors with 65 μm thick windings are fabricated. The increased winding thickness leads to a more than 3 times reduction in DC resistance compared with inductors built by other suspended inductors fabrication techniques.",

keywords = "power integrated circuits., silicon mold, Suspended inductor, thick winding",

author = "Yixiao DIng and Xiangming Fang and Rongxiang Wu and Qili Guo and Sin, \{Johnny K.O.\}",

note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII ; Conference date: 23-06-2019 Through 27-06-2019",

year = "2019",

month = jun,

doi = "10.1109/transducers.2019.8808586",

language = "English",

series = "2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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booktitle = "2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII",

}

DIng, Y, Fang, X, Wu, R, Guo, Q & Sin, JKO 2019, A Silicon Molded Metal Transfer Process for On-Chip Suspended Power Inductors. in 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII., 8808586, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII, Institute of Electrical and Electronics Engineers Inc., pp. 142-145, 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII, Berlin, Germany, 23/06/19. https://doi.org/10.1109/transducers.2019.8808586

A Silicon Molded Metal Transfer Process for On-Chip Suspended Power Inductors. / DIng, Yixiao; Fang, Xiangming; Wu, Rongxiang et al.
2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Institute of Electrical and Electronics Engineers Inc., 2019. p. 142-145 8808586 (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII).

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

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AU - DIng, Yixiao

AU - Fang, Xiangming

AU - Wu, Rongxiang

AU - Guo, Qili

AU - Sin, Johnny K.O.

PY - 2019/6

Y1 - 2019/6

N2 - In this paper, a novel silicon molded metal transfer process is developed to build on-chip suspended thick-winding inductors for high-frequency power management applications. In the proposed process, a silicon mold wafer coated with a heat-depolymerizable sacrificial layer is fabricated and used as the electroplating mold for thick-winding inductors formation; a simple transfer process is developed to release the inductors from the mold wafer and integrate the inductors with power IC chips. On-chip suspended power inductors with 65 μm thick windings are fabricated. The increased winding thickness leads to a more than 3 times reduction in DC resistance compared with inductors built by other suspended inductors fabrication techniques.

AB - In this paper, a novel silicon molded metal transfer process is developed to build on-chip suspended thick-winding inductors for high-frequency power management applications. In the proposed process, a silicon mold wafer coated with a heat-depolymerizable sacrificial layer is fabricated and used as the electroplating mold for thick-winding inductors formation; a simple transfer process is developed to release the inductors from the mold wafer and integrate the inductors with power IC chips. On-chip suspended power inductors with 65 μm thick windings are fabricated. The increased winding thickness leads to a more than 3 times reduction in DC resistance compared with inductors built by other suspended inductors fabrication techniques.

KW - power integrated circuits.

KW - silicon mold

KW - Suspended inductor

KW - thick winding

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M3 - Conference Paper published in a book

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BT - 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII

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ER -

DIng Y, Fang X, Wu R, Guo Q, Sin JKO. A Silicon Molded Metal Transfer Process for On-Chip Suspended Power Inductors. In 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Institute of Electrical and Electronics Engineers Inc. 2019. p. 142-145. 8808586. (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII). doi: 10.1109/transducers.2019.8808586

A Silicon Molded Metal Transfer Process for On-Chip Suspended Power Inductors

Abstract

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Bibliographical note

Keywords

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