Abstract
A simple low cost monolithic 3D through-silicon-via coreless transformer is designed and fabricated for high-voltage gate driver applications. The transformer comprises the primary coil embedded in the bottom layer of a Si substrate and the secondary coil built on the front-side of the substrate. Compared with conventional transformers with both coils built on the front-side or at the backside, the proposed structure has the advantages of area-saving and cost-effectiveness. A coreless transformer with primary, secondary, and mutual inductances of 260, 280, and 112 nH, respectively, is fabricated in a small area of 2 mm2. It achieves both high galvanic isolation (>4 kV) and satisfactory voltage gain (0.41 from 4 to 45 MHz).
| Original language | English |
|---|---|
| Article number | 6679248 |
| Pages (from-to) | 108-110 |
| Number of pages | 3 |
| Journal | IEEE Electron Device Letters |
| Volume | 35 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - Jan 2014 |
Keywords
- 3D TSV transformer
- Monolithic transformer
- digital isolator
- high-voltage isolation
Fingerprint
Dive into the research topics of 'A simple low cost monolithic transformer for high-voltage gate driver applications'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver