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A simple low cost monolithic transformer for high-voltage gate driver applications

  • Lulu Peng
  • , Rongxiang Wu
  • , Xiangming Fang
  • , Yoshiaki Toyoda
  • , Masashi Akahane
  • , Masaharu Yamaji
  • , Hitoshi Sumida
  • , Johnny K.O. Sin

Research output: Contribution to journalJournal Articlepeer-review

Abstract

A simple low cost monolithic 3D through-silicon-via coreless transformer is designed and fabricated for high-voltage gate driver applications. The transformer comprises the primary coil embedded in the bottom layer of a Si substrate and the secondary coil built on the front-side of the substrate. Compared with conventional transformers with both coils built on the front-side or at the backside, the proposed structure has the advantages of area-saving and cost-effectiveness. A coreless transformer with primary, secondary, and mutual inductances of 260, 280, and 112 nH, respectively, is fabricated in a small area of 2 mm2. It achieves both high galvanic isolation (>4 kV) and satisfactory voltage gain (0.41 from 4 to 45 MHz).

Original languageEnglish
Article number6679248
Pages (from-to)108-110
Number of pages3
JournalIEEE Electron Device Letters
Volume35
Issue number1
DOIs
Publication statusPublished - Jan 2014

Keywords

  • 3D TSV transformer
  • Monolithic transformer
  • digital isolator
  • high-voltage isolation

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