A study of thermal conductivity for porous polystyrene foams

Chih Hung Ying*, Pen Chang Tseng, Chih Chen Chang, Ming Lang Hung

*Corresponding author for this work

Research output: Contribution to conferenceConference Paperpeer-review

Abstract

This current study uses thermal conductivity of open cell polystyrene foams as the main axis of study, and carries out analysis comparison between the prediction value of theoretical thermal conductivity formula with the actually measured value of thermal conductivity meter (please refer to ASTM C518 for measurement standard) and to find the thermal formula of open cell polystyrene foams that are most suitable to be developed by this study, and make discussion according to the physical properties of open cell polystyrene foams. Under mean temperature of 25°C, there is 4.482% of mean deviation between the thermal conductivity derived from theoretical thermal conductivity formula and actually measured value.

Original languageEnglish
Pages3170-3175
Number of pages6
Publication statusPublished - 2004
Externally publishedYes
EventANTEC 2004 - Annual Technical Conference Proceedings - Chicago, IL., United States
Duration: 16 May 200420 May 2004

Conference

ConferenceANTEC 2004 - Annual Technical Conference Proceedings
Country/TerritoryUnited States
CityChicago, IL.
Period16/05/0420/05/04

Keywords

  • Extrusion
  • Insulation material
  • Open cell
  • Polystyrene foams
  • Thermal conductivity

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