A Study on Microstructure and Reliability Tests of Low Cost Flip Chip

Research output: Contribution to conference › Conference Paper

Original language	English
Publication status	Published - 2001
Event	The Fourth International Symposium on Electronic Packaging Technology, Beijing, China - Duration: 1 Jan 2001 → 1 Jan 2001

Conference	The Fourth International Symposium on Electronic Packaging Technology, Beijing, China
Period	1/01/01 → 1/01/01

Access to Document

@conference{8518bbcde05141ab91d8acf585e3a8a4,

title = "A Study on Microstructure and Reliability Tests of Low Cost Flip Chip",

author = "Jian Cai and Chan, \{Philip C.H.\} and Cheung, \{Annette T.\} and Law, \{Simon P.C.\} and Guowei Xiao",

year = "2001",

language = "English",

note = "The Fourth International Symposium on Electronic Packaging Technology, Beijing, China ; Conference date: 01-01-2001 Through 01-01-2001",

}