Abstract
Distinct trap levels in the drain access regions of an N-polar GaN MIS-HEMT are investigated before and after semi-on dc stressing by thermal and optical trap spectroscopies. The most prominent dc stress effect was an increase in concentration of a pre-existing electron trap with an activation energy of 0.54 eV, accompanied by a decrease in concentration of an electron trap with a 0.65-eV activation energy. These distinct states had similar concentrations before stressing, with the 0.54-eV trap concentration dominating (by 6 ×) after stress. Deeper states revealed via optical measurements showed a mild ∼20% increase in total concentration after stressing.
| Original language | English |
|---|---|
| Article number | 6175102 |
| Pages (from-to) | 658-660 |
| Number of pages | 3 |
| Journal | IEEE Electron Device Letters |
| Volume | 33 |
| Issue number | 5 |
| DOIs | |
| Publication status | Published - May 2012 |
| Externally published | Yes |
Keywords
- Constant current deep level optical spectroscopy (CID-DLOS)
- Constant current deep level transient spectroscopy (CID-DLTS)
- Dc stressing
- Deep levels
- GaN
- High-electron-mobility transistor (HEMT)
- Metal-organic chemical vapor deposition (MOCVD)
- Trapping