TY - GEN
T1 - An 82.4% efficiency package-bondwire-based four-phase fully integrated buck converter with flying capacitor for area reduction
AU - Huang, Cheng
AU - Mok, Philip K.T.
PY - 2013
Y1 - 2013
N2 - Multi-phase converters have become a topic of great interest due to the high output power capacity and output ripple cancellation effect. They are even more beneficial to nowadays high-frequency fully integrated converters with output capacitor integrated on-chip. As one of the dominant chip area consumers, reducing the size of the on-chip decoupling capacitors directly leads to cost down. It is reported that a 5× capacitor area reduction can be achieved with a four-phase converter compared to a single-phase one [1]. However, the penalty is obvious. Every extra phase comes with an inductor, which is also counted as cost and becomes more dominant with increase in the number of phases.
AB - Multi-phase converters have become a topic of great interest due to the high output power capacity and output ripple cancellation effect. They are even more beneficial to nowadays high-frequency fully integrated converters with output capacitor integrated on-chip. As one of the dominant chip area consumers, reducing the size of the on-chip decoupling capacitors directly leads to cost down. It is reported that a 5× capacitor area reduction can be achieved with a four-phase converter compared to a single-phase one [1]. However, the penalty is obvious. Every extra phase comes with an inductor, which is also counted as cost and becomes more dominant with increase in the number of phases.
UR - https://www.scopus.com/pages/publications/84876589869
U2 - 10.1109/ISSCC.2013.6487770
DO - 10.1109/ISSCC.2013.6487770
M3 - Conference Paper published in a book
AN - SCOPUS:84876589869
SN - 9781467345132
T3 - Digest of Technical Papers - IEEE International Solid-State Circuits Conference
SP - 362
EP - 363
BT - 2013 IEEE International Solid-State Circuits Conference, ISSCC 2013 - Digest of Technical Papers
T2 - 2013 60th IEEE International Solid-State Circuits Conference, ISSCC 2013
Y2 - 17 February 2013 through 21 February 2013
ER -