An 82.4% efficiency package-bondwire-based four-phase fully integrated buck converter with flying capacitor for area reduction

Cheng Huang*, Philip K.T. Mok

*Corresponding author for this work

Research output: Chapter in Book/Conference Proceeding/ReportConference Paper published in a bookpeer-review

27 Citations (Scopus)

Abstract

Multi-phase converters have become a topic of great interest due to the high output power capacity and output ripple cancellation effect. They are even more beneficial to nowadays high-frequency fully integrated converters with output capacitor integrated on-chip. As one of the dominant chip area consumers, reducing the size of the on-chip decoupling capacitors directly leads to cost down. It is reported that a 5× capacitor area reduction can be achieved with a four-phase converter compared to a single-phase one [1]. However, the penalty is obvious. Every extra phase comes with an inductor, which is also counted as cost and becomes more dominant with increase in the number of phases.

Original languageEnglish
Title of host publication2013 IEEE International Solid-State Circuits Conference, ISSCC 2013 - Digest of Technical Papers
Pages362-363
Number of pages2
DOIs
Publication statusPublished - 2013
Event2013 60th IEEE International Solid-State Circuits Conference, ISSCC 2013 - San Francisco, CA, United States
Duration: 17 Feb 201321 Feb 2013

Publication series

NameDigest of Technical Papers - IEEE International Solid-State Circuits Conference
Volume56
ISSN (Print)0193-6530

Conference

Conference2013 60th IEEE International Solid-State Circuits Conference, ISSCC 2013
Country/TerritoryUnited States
CitySan Francisco, CA
Period17/02/1321/02/13

Fingerprint

Dive into the research topics of 'An 82.4% efficiency package-bondwire-based four-phase fully integrated buck converter with flying capacitor for area reduction'. Together they form a unique fingerprint.

Cite this