An artificial neural network approach for screening test escapes

Research output: Chapter in Book/Conference Proceeding/ReportConference Paper published in a bookpeer-review

13 Citations (Scopus)

Abstract

In this paper we investigate the application of an artificial neural network (ANN) for screening test escapes. Specifically, we propose to train an autoencoder, an ANN, in an unsupervised way to fit the good chip population, i.e. using good chips only as the training set. The autoencoder is designed with both its input and output layers representing a set of features that characterize the test data of the chips under test, where we use the Euclidean distance between the values in the input and output layers as the cost function for training. Based on the trained autoencoder, if the test measurement of a query chip has an abnormally large value for the cost function, the chip is likely to be a test escape because it does not fit the characteristics of the good chip population captured by the model. We demonstrate that an autoencoder-based classification could achieve a higher detection rate for test escapes and a significant reduction in runtime and memory usage, compared with an SVM applied on the same features and some additional proximity features generated from multiple nonlinear transformations.

Original languageEnglish
Title of host publication2017 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages414-419
Number of pages6
ISBN (Electronic)9781509015580
DOIs
Publication statusPublished - 16 Feb 2017
Event22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017 - Chiba, Japan
Duration: 16 Jan 201719 Jan 2017

Publication series

NameProceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Conference

Conference22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017
Country/TerritoryJapan
CityChiba
Period16/01/1719/01/17

Bibliographical note

Publisher Copyright:
© 2017 IEEE.

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