An EDX-based oxidation test for evaluating Cu out-diffusion in pre-plated Cu-alloy leadframes

Lilin Liu; Tong Yi Zhang

An EDX-based oxidation test for evaluating Cu out-diffusion in pre-plated Cu-alloy leadframes

Lilin Liu
, Tong Yi Zhang^*

^*Corresponding author for this work

Department of Mechanical and Aerospace Engineering

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

Abstract

An EDX-based oxidation test associated with a simple theoretical model is developed to study Cu out-diffusion in pre-plated Cu-alloy leadframes with and without a nanometer-thick Cu-Ni-Sn IMC layer and oxidation at the PPF surfaces. The experimental results show that the Cu diffusion coefficients are (1.23×10^-10cm²/s)exp(-0.723eV/kT) in the IMC nano-layer during a temperature range 150°C-400°C and (1.59×10^-9cm²/s)exp(-0.602eV/kT) in the nickel layer during a temperature range 260°C-300°C, respectively. The in-situ formed IMC nanolayer is a more effective diffusion barrier than the Ni layer.

Original language	English
Title of host publication	TMS2008 - 137th Annual Meeting and Exhibition Supplemental Proceedings
Subtitle of host publication	Materials Processing and Properties
Pages	263-268
Number of pages	6
Publication status	Published - 2008
Event	TMS 2008 Annual Meeting Supplemental: Materials Processing and Properties - New Orleans, LA, United States Duration: 9 Mar 2008 → 13 Mar 2008

Publication series

Name	TMS Annual Meeting
Volume	1

Conference

Conference	TMS 2008 Annual Meeting Supplemental: Materials Processing and Properties
Country/Territory	United States
City	New Orleans, LA
Period	9/03/08 → 13/03/08

Keywords

Diffusion barrier
EDX
Intermetallic compound(IMC)
Nanolayers
Pre-Plated Leadframe(PPF)

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https://hdl.handle.net/1783.1/38061

Cite this

@inproceedings{2ec4a517ce224fb2938dd64e59a95fad,

title = "An EDX-based oxidation test for evaluating Cu out-diffusion in pre-plated Cu-alloy leadframes",

abstract = "An EDX-based oxidation test associated with a simple theoretical model is developed to study Cu out-diffusion in pre-plated Cu-alloy leadframes with and without a nanometer-thick Cu-Ni-Sn IMC layer and oxidation at the PPF surfaces. The experimental results show that the Cu diffusion coefficients are (1.23×10-10cm2/s)exp(-0.723eV/kT) in the IMC nano-layer during a temperature range 150°C-400°C and (1.59×10-9cm2/s)exp(-0.602eV/kT) in the nickel layer during a temperature range 260°C-300°C, respectively. The in-situ formed IMC nanolayer is a more effective diffusion barrier than the Ni layer.",

keywords = "Diffusion barrier, EDX, Intermetallic compound(IMC), Nanolayers, Pre-Plated Leadframe(PPF)",

author = "Lilin Liu and Zhang, \{Tong Yi\}",

year = "2008",

language = "English",

isbn = "9780873397162",

series = "TMS Annual Meeting",

pages = "263--268",

booktitle = "TMS2008 - 137th Annual Meeting and Exhibition Supplemental Proceedings",

note = "TMS 2008 Annual Meeting Supplemental: Materials Processing and Properties ; Conference date: 09-03-2008 Through 13-03-2008",

}

Liu, L & Zhang, TY 2008, An EDX-based oxidation test for evaluating Cu out-diffusion in pre-plated Cu-alloy leadframes. in TMS2008 - 137th Annual Meeting and Exhibition Supplemental Proceedings: Materials Processing and Properties. TMS Annual Meeting, vol. 1, pp. 263-268, TMS 2008 Annual Meeting Supplemental: Materials Processing and Properties, New Orleans, LA, United States, 9/03/08. <https://hdl.handle.net/1783.1/38061>

An EDX-based oxidation test for evaluating Cu out-diffusion in pre-plated Cu-alloy leadframes. / Liu, Lilin; Zhang, Tong Yi.
TMS2008 - 137th Annual Meeting and Exhibition Supplemental Proceedings: Materials Processing and Properties. 2008. p. 263-268 (TMS Annual Meeting; Vol. 1).

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

TY - GEN

T1 - An EDX-based oxidation test for evaluating Cu out-diffusion in pre-plated Cu-alloy leadframes

AU - Liu, Lilin

AU - Zhang, Tong Yi

PY - 2008

Y1 - 2008

N2 - An EDX-based oxidation test associated with a simple theoretical model is developed to study Cu out-diffusion in pre-plated Cu-alloy leadframes with and without a nanometer-thick Cu-Ni-Sn IMC layer and oxidation at the PPF surfaces. The experimental results show that the Cu diffusion coefficients are (1.23×10-10cm2/s)exp(-0.723eV/kT) in the IMC nano-layer during a temperature range 150°C-400°C and (1.59×10-9cm2/s)exp(-0.602eV/kT) in the nickel layer during a temperature range 260°C-300°C, respectively. The in-situ formed IMC nanolayer is a more effective diffusion barrier than the Ni layer.

AB - An EDX-based oxidation test associated with a simple theoretical model is developed to study Cu out-diffusion in pre-plated Cu-alloy leadframes with and without a nanometer-thick Cu-Ni-Sn IMC layer and oxidation at the PPF surfaces. The experimental results show that the Cu diffusion coefficients are (1.23×10-10cm2/s)exp(-0.723eV/kT) in the IMC nano-layer during a temperature range 150°C-400°C and (1.59×10-9cm2/s)exp(-0.602eV/kT) in the nickel layer during a temperature range 260°C-300°C, respectively. The in-situ formed IMC nanolayer is a more effective diffusion barrier than the Ni layer.

KW - Diffusion barrier

KW - EDX

KW - Intermetallic compound(IMC)

KW - Nanolayers

KW - Pre-Plated Leadframe(PPF)

UR - https://www.scopus.com/pages/publications/53849144341

M3 - Conference Paper published in a book

AN - SCOPUS:53849144341

SN - 9780873397162

T3 - TMS Annual Meeting

SP - 263

EP - 268

BT - TMS2008 - 137th Annual Meeting and Exhibition Supplemental Proceedings

T2 - TMS 2008 Annual Meeting Supplemental: Materials Processing and Properties

Y2 - 9 March 2008 through 13 March 2008

ER -

An EDX-based oxidation test for evaluating Cu out-diffusion in pre-plated Cu-alloy leadframes

Abstract

Publication series

Conference

Keywords

Access to Document

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