TY - JOUR
T1 - An empirical model to determine the grain size of metal-induced lateral crystallized film
AU - Chan, Victor W.C.
AU - Chan, Philip C.H.
PY - 2002/8
Y1 - 2002/8
N2 - Thin-film transistors (TFTs) have been fabricated using the nickel-seeded metal-induced lateral crystallization (MILC), in which an amorphous silicon is crystallized to form a large grain polysilicon film. Single crystal SOI, solid phase crystallization (SPC), and MILC TFTs were fabricated and the carrier mobilities extracted. Different types of devices have different variations in electrical properties. An empirical model based on the presence of the grain boundaries is proposed to explain the experimental results. The experimental data was used to extract the model parameters and the number of grains and grain size present in the device channel. The results can be further used to optimize the crystallization process and the device design.
AB - Thin-film transistors (TFTs) have been fabricated using the nickel-seeded metal-induced lateral crystallization (MILC), in which an amorphous silicon is crystallized to form a large grain polysilicon film. Single crystal SOI, solid phase crystallization (SPC), and MILC TFTs were fabricated and the carrier mobilities extracted. Different types of devices have different variations in electrical properties. An empirical model based on the presence of the grain boundaries is proposed to explain the experimental results. The experimental data was used to extract the model parameters and the number of grains and grain size present in the device channel. The results can be further used to optimize the crystallization process and the device design.
KW - Grain boundary effect
KW - Metal-induced lateral crystallization (MILC)
KW - Mobility
KW - Modeling
KW - Silicon-on-insulator (SOI)
KW - Surface roughness
KW - Thin-film transistor (TFT)
UR - https://www.webofscience.com/wos/woscc/full-record/WOS:000177114700011
UR - https://openalex.org/W2132006177
UR - https://www.scopus.com/pages/publications/0036683921
U2 - 10.1109/TED.2002.801269
DO - 10.1109/TED.2002.801269
M3 - Journal Article
SN - 0018-9383
VL - 49
SP - 1399
EP - 1404
JO - IEEE Transactions on Electron Devices
JF - IEEE Transactions on Electron Devices
IS - 8
ER -