Abstract
Novel bridged-grain (BG) technique is applied in the fabrication of low-temperature solid-phase-crystallized polycrystalline-silicon thin-film transistors. As a result of improved current flow and reduction of high drain electric field, the subthreshold slope, threshold voltage, maximum field-effect mobility, leakage current, and on-off ratio are greatly improved. Mechanisms of BG conduction are studied in detail.
| Original language | English |
|---|---|
| Article number | 6290340 |
| Pages (from-to) | 1414-1416 |
| Number of pages | 3 |
| Journal | IEEE Electron Device Letters |
| Volume | 33 |
| Issue number | 10 |
| DOIs | |
| Publication status | Published - 2012 |
Keywords
- Bridged grain (BG)
- polycrystalline silicon (poly-Si)
- thin-film transistors (TFTs)
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