CAD tool design space exploration via bayesian optimization

Yuzhe Ma, Ziyang Yu, Bei Yu

Research output: Chapter in Book/Conference Proceeding/ReportConference Paper published in a bookpeer-review

40 Citations (Scopus)

Abstract

The design complexity is increasing as the technology node keeps scaling down. As a result, the electronic design automation (EDA) tools also become more and more complex. There are lots of parameters involved in EDA tools, which results in a huge design space. What's worse, the runtime cost of the EDA flow also goes up as the complexity increases, thus exhaustive exploration is prohibitive for modern designs. Therefore, an efficient design space exploration methodology is of great importance in advanced designs. In this paper we target at an automatic flow for reducing manual tuning efforts to achieve high quality circuits synthesis outcomes. It is based on Bayesian optimization which is a promising technique for optimizing black-box functions that are expensive to evaluate. Gaussian process regression is leveraged as the surrogate model in Bayesian optimization framework. In this work, we use 64-bit prefix adder design as a case study. We demonstrate that the Bayesian optimization is efficient and effective for performing design space exploration on EDA tool parameters, which has great potential for accelerating the design flow in advanced technology nodes.

Original languageEnglish
Title of host publication2019 ACM/IEEE 1st Workshop on Machine Learning for CAD, MLCAD 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728157580
DOIs
Publication statusPublished - Sept 2019
Externally publishedYes
Event1st ACM/IEEE Workshop on Machine Learning for CAD, MLCAD 2019 - Canmore, Canada
Duration: 3 Sept 20194 Sept 2019

Publication series

Name2019 ACM/IEEE 1st Workshop on Machine Learning for CAD, MLCAD 2019

Conference

Conference1st ACM/IEEE Workshop on Machine Learning for CAD, MLCAD 2019
Country/TerritoryCanada
CityCanmore
Period3/09/194/09/19

Bibliographical note

Publisher Copyright:
© 2019 IEEE.

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