Compact GaN Power Modules with Direct Bonded Liquid-Cooled Heat Exchanger Suitable for EV Applications

W. J. Zhang; J. Liang; W. T. Cui; N. Kim; R. Li; A. Catuneanu; M. Birkett; J. G. Burgers; W. T. Ng

doi:10.1109/WiPDA49284.2021.9645122

Compact GaN Power Modules with Direct Bonded Liquid-Cooled Heat Exchanger Suitable for EV Applications

W. J. Zhang, J. Liang, W. T. Cui, N. Kim, R. Li, A. Catuneanu, M. Birkett, J. G. Burgers, W. T. Ng

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

4 Citations (Scopus)

Abstract

In this paper, a direct bonded GaN intelligent power module (IPM) with liquid cooling is demonstrated. A half bridge module with GaN high electron mobility transistors (HEMTs) is bonded on active metal brazed (AMB) substrates which are pre-brazed on a copper liquid-cooled heat exchanger. The design of this power module, such as the selections of the GaN dies and the placement of the GaN dies with respect to the AMB dimensions, is determined based on thermal simulations, estimated electrical parasitics and experiments. The prototype GaN IPMs are demonstrated in a buck converter configuration. The modules are tested up to 110 W with top surface temperature of the PCB module kept below 125°c, measured by an infrared camera (FLIR). The proposed IPM with liquid cooling offers an effective packaging solution for electric vehicle applications.

Original language	English
Title of host publication	2021 IEEE 8th Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2021 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	123-128
Number of pages	6
ISBN (Electronic)	9781665401814
DOIs	https://doi.org/10.1109/WiPDA49284.2021.9645122
Publication status	Published - 2021
Externally published	Yes
Event	8th Annual IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2021 - Virtual, Online, United States Duration: 7 Nov 2021 → 11 Nov 2021

Publication series

Name	2021 IEEE 8th Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2021 - Proceedings

Conference

Conference	8th Annual IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2021
Country/Territory	United States
City	Virtual, Online
Period	7/11/21 → 11/11/21

Bibliographical note

Publisher Copyright:
© 2021 IEEE.

Keywords

Flip-chip bonding
GaN power module
Liquid cooling
Power electronics
Thermal management

Access to Document

10.1109/WiPDA49284.2021.9645122

Cite this

Zhang, W. J., Liang, J., Cui, W. T., Kim, N., Li, R., Catuneanu, A., Birkett, M., Burgers, J. G., & Ng, W. T. (2021). Compact GaN Power Modules with Direct Bonded Liquid-Cooled Heat Exchanger Suitable for EV Applications. In 2021 IEEE 8th Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2021 - Proceedings (pp. 123-128). (2021 IEEE 8th Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2021 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/WiPDA49284.2021.9645122

Zhang, W. J. ; Liang, J. ; Cui, W. T. et al. / Compact GaN Power Modules with Direct Bonded Liquid-Cooled Heat Exchanger Suitable for EV Applications. 2021 IEEE 8th Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2021 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2021. pp. 123-128 (2021 IEEE 8th Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2021 - Proceedings).

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title = "Compact GaN Power Modules with Direct Bonded Liquid-Cooled Heat Exchanger Suitable for EV Applications",

abstract = "In this paper, a direct bonded GaN intelligent power module (IPM) with liquid cooling is demonstrated. A half bridge module with GaN high electron mobility transistors (HEMTs) is bonded on active metal brazed (AMB) substrates which are pre-brazed on a copper liquid-cooled heat exchanger. The design of this power module, such as the selections of the GaN dies and the placement of the GaN dies with respect to the AMB dimensions, is determined based on thermal simulations, estimated electrical parasitics and experiments. The prototype GaN IPMs are demonstrated in a buck converter configuration. The modules are tested up to 110 W with top surface temperature of the PCB module kept below 125°c, measured by an infrared camera (FLIR). The proposed IPM with liquid cooling offers an effective packaging solution for electric vehicle applications.",

keywords = "Flip-chip bonding, GaN power module, Liquid cooling, Power electronics, Thermal management",

author = "Zhang, \{W. J.\} and J. Liang and Cui, \{W. T.\} and N. Kim and R. Li and A. Catuneanu and M. Birkett and Burgers, \{J. G.\} and Ng, \{W. T.\}",

note = "Publisher Copyright: {\textcopyright} 2021 IEEE.; 8th Annual IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2021 ; Conference date: 07-11-2021 Through 11-11-2021",

year = "2021",

doi = "10.1109/WiPDA49284.2021.9645122",

language = "English",

series = "2021 IEEE 8th Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2021 - Proceedings",

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Zhang, WJ, Liang, J, Cui, WT, Kim, N, Li, R, Catuneanu, A, Birkett, M, Burgers, JG & Ng, WT 2021, Compact GaN Power Modules with Direct Bonded Liquid-Cooled Heat Exchanger Suitable for EV Applications. in 2021 IEEE 8th Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2021 - Proceedings. 2021 IEEE 8th Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2021 - Proceedings, Institute of Electrical and Electronics Engineers Inc., pp. 123-128, 8th Annual IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2021, Virtual, Online, United States, 7/11/21. https://doi.org/10.1109/WiPDA49284.2021.9645122

Compact GaN Power Modules with Direct Bonded Liquid-Cooled Heat Exchanger Suitable for EV Applications. / Zhang, W. J.; Liang, J.; Cui, W. T. et al.
2021 IEEE 8th Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2021 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2021. p. 123-128 (2021 IEEE 8th Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2021 - Proceedings).

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

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AU - Zhang, W. J.

AU - Liang, J.

AU - Cui, W. T.

AU - Kim, N.

AU - Li, R.

AU - Catuneanu, A.

AU - Birkett, M.

AU - Burgers, J. G.

AU - Ng, W. T.

PY - 2021

Y1 - 2021

N2 - In this paper, a direct bonded GaN intelligent power module (IPM) with liquid cooling is demonstrated. A half bridge module with GaN high electron mobility transistors (HEMTs) is bonded on active metal brazed (AMB) substrates which are pre-brazed on a copper liquid-cooled heat exchanger. The design of this power module, such as the selections of the GaN dies and the placement of the GaN dies with respect to the AMB dimensions, is determined based on thermal simulations, estimated electrical parasitics and experiments. The prototype GaN IPMs are demonstrated in a buck converter configuration. The modules are tested up to 110 W with top surface temperature of the PCB module kept below 125°c, measured by an infrared camera (FLIR). The proposed IPM with liquid cooling offers an effective packaging solution for electric vehicle applications.

AB - In this paper, a direct bonded GaN intelligent power module (IPM) with liquid cooling is demonstrated. A half bridge module with GaN high electron mobility transistors (HEMTs) is bonded on active metal brazed (AMB) substrates which are pre-brazed on a copper liquid-cooled heat exchanger. The design of this power module, such as the selections of the GaN dies and the placement of the GaN dies with respect to the AMB dimensions, is determined based on thermal simulations, estimated electrical parasitics and experiments. The prototype GaN IPMs are demonstrated in a buck converter configuration. The modules are tested up to 110 W with top surface temperature of the PCB module kept below 125°c, measured by an infrared camera (FLIR). The proposed IPM with liquid cooling offers an effective packaging solution for electric vehicle applications.

KW - Flip-chip bonding

KW - GaN power module

KW - Liquid cooling

KW - Power electronics

KW - Thermal management

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M3 - Conference Paper published in a book

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EP - 128

BT - 2021 IEEE 8th Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2021 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 8th Annual IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2021

Y2 - 7 November 2021 through 11 November 2021

ER -

Zhang WJ, Liang J, Cui WT, Kim N, Li R, Catuneanu A et al. Compact GaN Power Modules with Direct Bonded Liquid-Cooled Heat Exchanger Suitable for EV Applications. In 2021 IEEE 8th Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2021 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2021. p. 123-128. (2021 IEEE 8th Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2021 - Proceedings). doi: 10.1109/WiPDA49284.2021.9645122

Compact GaN Power Modules with Direct Bonded Liquid-Cooled Heat Exchanger Suitable for EV Applications

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Keywords

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