TY - GEN
T1 - Comparison of joint strength and fracture energy of lead-free solder balls in high speed ball shear/pull tests and their correlation with board level drop test
AU - Song, Fubin
AU - Ricky Lee, S. W.
AU - Newman, Keith
AU - Clark, Stephen
AU - Sykes, Bob
PY - 2007
Y1 - 2007
N2 - A comprehensive solder joint reliability study was conducted using both high-speed solder ball shear/pull and board level drop testing (BLDT). The samples were divided into groups which were subject to various periods of thermal aging (125°C, up to 500 hours) in order to accelerate the formation of intermetallic compound (IMC) in the solder joints. The ball shear tests ranged from 10 mm/s to 3,000 mm/s while the ball pull tests ranged from 5 mm/s to 500 mm/s. A total of 6 unique package constructions were evaluated, ranging from a 316 PBGA (27 mm, sq) to a 2,395 CBGA (51 mm, sq). The samples used SAC lead-free solder balls and a variety of pad surface finishes. Detailed failure analyses were performed to identify the failed solder joints and corresponding failure modes. The failure modes and loading speeds of ball shear and ball pull tests were cross-referenced with the mechanical drop tests for comparison. Correlation models were established relating drops-to-failure with both solder ball fracture force and energy.
AB - A comprehensive solder joint reliability study was conducted using both high-speed solder ball shear/pull and board level drop testing (BLDT). The samples were divided into groups which were subject to various periods of thermal aging (125°C, up to 500 hours) in order to accelerate the formation of intermetallic compound (IMC) in the solder joints. The ball shear tests ranged from 10 mm/s to 3,000 mm/s while the ball pull tests ranged from 5 mm/s to 500 mm/s. A total of 6 unique package constructions were evaluated, ranging from a 316 PBGA (27 mm, sq) to a 2,395 CBGA (51 mm, sq). The samples used SAC lead-free solder balls and a variety of pad surface finishes. Detailed failure analyses were performed to identify the failed solder joints and corresponding failure modes. The failure modes and loading speeds of ball shear and ball pull tests were cross-referenced with the mechanical drop tests for comparison. Correlation models were established relating drops-to-failure with both solder ball fracture force and energy.
UR - https://www.webofscience.com/wos/woscc/full-record/WOS:000253874600082
UR - https://openalex.org/W2108765888
UR - https://www.scopus.com/pages/publications/50049098590
U2 - 10.1109/EPTC.2007.4469720
DO - 10.1109/EPTC.2007.4469720
M3 - Conference Paper published in a book
SN - 1424413249
SN - 9781424413249
T3 - Proceedings of the Electronic Packaging Technology Conference, EPTC
SP - 450
EP - 458
BT - 9th Electronics Packaging Technology Conference, EPTC 2007
T2 - 9th Electronics Packaging Technology Conference, EPTC 2007
Y2 - 12 December 2007 through 12 December 2007
ER -