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Correction to: A 3-D Assembled Silicon-Embedded Transformer for 10-MHz, Ultra-High-Isolation, Compact Chip-to-Chip Power Transfer

  • Xiangming Fang
  • , Jian Cai
  • , Qian Wang
  • , Niteng Liao
  • , Rongxiang Wu*
  • , Johnny Kin On Sin
  • *Corresponding author for this work

Research output: Other contributionpeer-review

Abstract

In the above paper [1] , the seventh reference “R. Wu, J. K. O. Sin, and S. Y. Hui, ‘A novel silicon-embedded coreless transformer for isolated DC-DC converter application,’ in Proc. IEEE 23rd Int. Symp. Power Semiconductor Devices ICs , Hong Kong, China, May 2015, pp. 297–300, doi: 10.1109/ISPSD.2011.5890863” is incorrect. The correct reference is “R. Wu, N. Liao, X. Fang, and J. K. O. Sin, ‘A novel 3D transformer for ultra-compact signal isolation,’ in Proc. IEEE 27th Int. Symp. Power Semiconductor Devices ICs , Hong Kong, China, May 2015, pp. 297-300, doi: 10.1109/ISPSD.2015.7123448.”
Original languageEnglish
Publication statusPublished - 2017

Publication series

NameIEEE Electron Device Letters
ISSN (Print)07413106
ISSN (Electronic)'15580563

Keywords

  • Electricity saving
  • Climate Change Adaptation
  • Fukushima Accident
  • Extreme Weather

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