TY - GEN
T1 - Cu out-diffusion kinetics in pre-plated Cu-alloy leadframes investigated by a developed EDX-based oxidation test
AU - Liu, Lilin
AU - Fu, Ran
AU - Liu, Deming
AU - Zhang, Tong Yi
PY - 2008
Y1 - 2008
N2 - The Energy Dispersive X-ray (EDX)-based permeation and oxidation test has been further developed by a novel theoretical analysis, in which the gradient of chemical potential rather than the concentration gradient is employed. The EDX-based permeation and oxidation tests determine Cu flux coefficients in the CuO oxide layers to be 4.17×1026 mol·(m·s· kJ/mol)-1exp(-70.30 kJ·mol-1/RT) in temperature range of 250 °C - 400 °C. And the Cu flux coefficients in the Ni layers are 1.72×10-32 mol·(m·s·kJ/mol) -1 and 5.92×10-32 mol·(m·s·kJ/ mol)-1 at temperatures of 250 °C and 300 °C, respectively.
AB - The Energy Dispersive X-ray (EDX)-based permeation and oxidation test has been further developed by a novel theoretical analysis, in which the gradient of chemical potential rather than the concentration gradient is employed. The EDX-based permeation and oxidation tests determine Cu flux coefficients in the CuO oxide layers to be 4.17×1026 mol·(m·s· kJ/mol)-1exp(-70.30 kJ·mol-1/RT) in temperature range of 250 °C - 400 °C. And the Cu flux coefficients in the Ni layers are 1.72×10-32 mol·(m·s·kJ/mol) -1 and 5.92×10-32 mol·(m·s·kJ/ mol)-1 at temperatures of 250 °C and 300 °C, respectively.
UR - https://www.scopus.com/pages/publications/52449113984
U2 - 10.1109/ICEPT.2008.4607081
DO - 10.1109/ICEPT.2008.4607081
M3 - Conference Paper published in a book
AN - SCOPUS:52449113984
SN - 9781424427406
T3 - Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
BT - Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
T2 - 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
Y2 - 28 July 2008 through 31 July 2008
ER -