Deep learning-driven simultaneous layout decomposition and mask optimization

Wei Zhong*, Shuxiang Hu*, Yuzhe Ma, Haoyu Yang, Xiuyuan Ma*, Bei Yu

*Corresponding author for this work

Research output: Chapter in Book/Conference Proceeding/ReportConference Paper published in a bookpeer-review

10 Citations (Scopus)

Abstract

Combining multiple pattern lithography (MPL) and optical proximity correlation (OPC) pushes the limit of 193nm wavelength lithography to go further. Considering that layout decomposition may generate plenty of solutions with diverse printabilities, relying on conventional mask optimization process to select the best candidates for manufacturing is computationally expensive. Therefore, an accurate and efficient printability estimation is crucial and can significantly accelerate the layout decomposition and mask optimization (LDMO) process. In this paper, we propose a CNN based prediction and integrate it into our new high performance LDMO framework. We also develop both the layout and the decomposition sampling strategies to facilitate the network training. The experimental results demonstrate the effectiveness and the efficiency of the proposed algorithms.

Original languageEnglish
Title of host publication2020 57th ACM/IEEE Design Automation Conference, DAC 2020
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781450367257
DOIs
Publication statusPublished - Jul 2020
Externally publishedYes
Event57th ACM/IEEE Design Automation Conference, DAC 2020 - Virtual, San Francisco, United States
Duration: 20 Jul 202024 Jul 2020

Publication series

NameProceedings - Design Automation Conference
Volume2020-July
ISSN (Print)0738-100X

Conference

Conference57th ACM/IEEE Design Automation Conference, DAC 2020
Country/TerritoryUnited States
CityVirtual, San Francisco
Period20/07/2024/07/20

Bibliographical note

Publisher Copyright:
© 2020 IEEE.

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