Development of low temperature processing thermoplastic intrinsically conductive polymer

Linda L.W. Chow; J. Li; Matthew M.F. Yuen

doi:10.1109/isapm.2002.990375

Development of low temperature processing thermoplastic intrinsically conductive polymer

Linda L.W. Chow, J. Li, Matthew M.F. Yuen

Department of Mechanical and Aerospace Engineering

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

8 Citations (Scopus)

Abstract

To find an alternative to reliable eutectic solder interconnects for electronics, mems and optoelectronics packaging, a new thermoplastic intrinsically conductive polymer, doped polyaniline is proposed. It has an attractive low processing temperature, <50 °C and it exhibits stable resistance with gold under Jedec level 1, 85 °C/85 % relative humidity for over 7 days. Cresol, the solvent, is a strong oxidizing agent to many metal; yet, XPS shows no corrosion on gold substrate. Die shear tests show that mechanical interlocking does play an important role. Etched surface with larger roughness has fourfold enhancement in shear strength.

Original language	English
Title of host publication	2002 Proceedings - 8th International Advanced Packaging Materials Symposium
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	127-131
Number of pages	5
ISBN (Electronic)	0780374347, 9780780374348
DOIs	https://doi.org/10.1109/isapm.2002.990375
Publication status	Published - 2002
Event	8th International Advanced Packaging Materials Symposium - Stone Mountain, United States Duration: 3 Mar 2002 → 6 Mar 2002

Publication series

Name	2002 Proceedings - 8th International Advanced Packaging Materials Symposium

Conference

Conference	8th International Advanced Packaging Materials Symposium
Country/Territory	United States
City	Stone Mountain
Period	3/03/02 → 6/03/02

Bibliographical note

Publisher Copyright:
© 2002 IEEE.

Access to Document

10.1109/isapm.2002.990375

Cite this

Chow, L. L. W., Li, J., & Yuen, M. M. F. (2002). Development of low temperature processing thermoplastic intrinsically conductive polymer. In 2002 Proceedings - 8th International Advanced Packaging Materials Symposium (pp. 127-131). Article 990375 (2002 Proceedings - 8th International Advanced Packaging Materials Symposium). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/isapm.2002.990375

@inproceedings{ad97673c5cc149a99d0466d7086629da,

title = "Development of low temperature processing thermoplastic intrinsically conductive polymer",

abstract = "To find an alternative to reliable eutectic solder interconnects for electronics, mems and optoelectronics packaging, a new thermoplastic intrinsically conductive polymer, doped polyaniline is proposed. It has an attractive low processing temperature, <50 °C and it exhibits stable resistance with gold under Jedec level 1, 85 °C/85 \% relative humidity for over 7 days. Cresol, the solvent, is a strong oxidizing agent to many metal; yet, XPS shows no corrosion on gold substrate. Die shear tests show that mechanical interlocking does play an important role. Etched surface with larger roughness has fourfold enhancement in shear strength.",

author = "Chow, \{Linda L.W.\} and J. Li and Yuen, \{Matthew M.F.\}",

note = "Publisher Copyright: {\textcopyright} 2002 IEEE.; 8th International Advanced Packaging Materials Symposium ; Conference date: 03-03-2002 Through 06-03-2002",

year = "2002",

doi = "10.1109/isapm.2002.990375",

language = "English",

series = "2002 Proceedings - 8th International Advanced Packaging Materials Symposium",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "127--131",

booktitle = "2002 Proceedings - 8th International Advanced Packaging Materials Symposium",

}

Chow, LLW, Li, J & Yuen, MMF 2002, Development of low temperature processing thermoplastic intrinsically conductive polymer. in 2002 Proceedings - 8th International Advanced Packaging Materials Symposium., 990375, 2002 Proceedings - 8th International Advanced Packaging Materials Symposium, Institute of Electrical and Electronics Engineers Inc., pp. 127-131, 8th International Advanced Packaging Materials Symposium, Stone Mountain, United States, 3/03/02. https://doi.org/10.1109/isapm.2002.990375

Development of low temperature processing thermoplastic intrinsically conductive polymer. / Chow, Linda L.W.; Li, J.; Yuen, Matthew M.F.
2002 Proceedings - 8th International Advanced Packaging Materials Symposium. Institute of Electrical and Electronics Engineers Inc., 2002. p. 127-131 990375 (2002 Proceedings - 8th International Advanced Packaging Materials Symposium).

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

TY - GEN

T1 - Development of low temperature processing thermoplastic intrinsically conductive polymer

AU - Chow, Linda L.W.

AU - Li, J.

AU - Yuen, Matthew M.F.

PY - 2002

Y1 - 2002

N2 - To find an alternative to reliable eutectic solder interconnects for electronics, mems and optoelectronics packaging, a new thermoplastic intrinsically conductive polymer, doped polyaniline is proposed. It has an attractive low processing temperature, <50 °C and it exhibits stable resistance with gold under Jedec level 1, 85 °C/85 % relative humidity for over 7 days. Cresol, the solvent, is a strong oxidizing agent to many metal; yet, XPS shows no corrosion on gold substrate. Die shear tests show that mechanical interlocking does play an important role. Etched surface with larger roughness has fourfold enhancement in shear strength.

AB - To find an alternative to reliable eutectic solder interconnects for electronics, mems and optoelectronics packaging, a new thermoplastic intrinsically conductive polymer, doped polyaniline is proposed. It has an attractive low processing temperature, <50 °C and it exhibits stable resistance with gold under Jedec level 1, 85 °C/85 % relative humidity for over 7 days. Cresol, the solvent, is a strong oxidizing agent to many metal; yet, XPS shows no corrosion on gold substrate. Die shear tests show that mechanical interlocking does play an important role. Etched surface with larger roughness has fourfold enhancement in shear strength.

UR - https://www.scopus.com/pages/publications/84892218104

U2 - 10.1109/isapm.2002.990375

DO - 10.1109/isapm.2002.990375

M3 - Conference Paper published in a book

AN - SCOPUS:84892218104

T3 - 2002 Proceedings - 8th International Advanced Packaging Materials Symposium

SP - 127

EP - 131

BT - 2002 Proceedings - 8th International Advanced Packaging Materials Symposium

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 8th International Advanced Packaging Materials Symposium

Y2 - 3 March 2002 through 6 March 2002

ER -

Chow LLW, Li J, Yuen MMF. Development of low temperature processing thermoplastic intrinsically conductive polymer. In 2002 Proceedings - 8th International Advanced Packaging Materials Symposium. Institute of Electrical and Electronics Engineers Inc. 2002. p. 127-131. 990375. (2002 Proceedings - 8th International Advanced Packaging Materials Symposium). doi: 10.1109/isapm.2002.990375

Development of low temperature processing thermoplastic intrinsically conductive polymer

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