Development of surface mount compatible reel-to-reel assembly process of LED arrays for wide area general lighting

S. W.Ricky Lee; Y. W. Tong; Y. S. Chan; J. C.C. Lo; R. Zhang

doi:10.1109/EMAP.2008.4784277

Development of surface mount compatible reel-to-reel assembly process of LED arrays for wide area general lighting

S. W.Ricky Lee, Y. W. Tong, Y. S. Chan, J. C.C. Lo, R. Zhang

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

Abstract

The objective of the present study is to develop a robust high through put assembly process of light emitting diode arrays for wide area general lighting. Topics to be covered in this paper include the conceptual design, the flexible printed circuit substrate, flip chip assembly, yellow phosphor coating, and encapsulation. All these are integrated into one reel-to-reel assembly process. A prototype with the proposed process has been developed. A sample strip of packaged LED array has been produced as well. Recommendations for future industrial applications are also provided.

Original language	English
Title of host publication	2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
Pages	255-258
Number of pages	4
DOIs	https://doi.org/10.1109/EMAP.2008.4784277
Publication status	Published - 2008
Event	2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 - Taipei, Taiwan, Province of China Duration: 22 Oct 2008 → 24 Oct 2008

Publication series

Name	2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008

Conference

Conference	2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
Country/Territory	Taiwan, Province of China
City	Taipei
Period	22/10/08 → 24/10/08

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

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10.1109/EMAP.2008.4784277

Cite this

Lee, S. W. R., Tong, Y. W., Chan, Y. S., Lo, J. C. C., & Zhang, R. (2008). Development of surface mount compatible reel-to-reel assembly process of LED arrays for wide area general lighting. In 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 (pp. 255-258). Article 4784277 (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008). https://doi.org/10.1109/EMAP.2008.4784277

@inproceedings{146eb619f6e94d5480722150b35f9a08,

title = "Development of surface mount compatible reel-to-reel assembly process of LED arrays for wide area general lighting",

abstract = "The objective of the present study is to develop a robust high through put assembly process of light emitting diode arrays for wide area general lighting. Topics to be covered in this paper include the conceptual design, the flexible printed circuit substrate, flip chip assembly, yellow phosphor coating, and encapsulation. All these are integrated into one reel-to-reel assembly process. A prototype with the proposed process has been developed. A sample strip of packaged LED array has been produced as well. Recommendations for future industrial applications are also provided.",

author = "Lee, \{S. W.Ricky\} and Tong, \{Y. W.\} and Chan, \{Y. S.\} and Lo, \{J. C.C.\} and R. Zhang",

year = "2008",

doi = "10.1109/EMAP.2008.4784277",

language = "English",

isbn = "9781424436217",

series = "2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008",

pages = "255--258",

booktitle = "2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008",

note = "2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 ; Conference date: 22-10-2008 Through 24-10-2008",

}

Lee, SWR, Tong, YW, Chan, YS, Lo, JCC & Zhang, R 2008, Development of surface mount compatible reel-to-reel assembly process of LED arrays for wide area general lighting. in 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008., 4784277, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp. 255-258, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, Taipei, Taiwan, Province of China, 22/10/08. https://doi.org/10.1109/EMAP.2008.4784277

Development of surface mount compatible reel-to-reel assembly process of LED arrays for wide area general lighting. / Lee, S. W.Ricky; Tong, Y. W.; Chan, Y. S. et al.
2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008. 2008. p. 255-258 4784277 (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008).

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

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AU - Chan, Y. S.

AU - Lo, J. C.C.

AU - Zhang, R.

PY - 2008

Y1 - 2008

N2 - The objective of the present study is to develop a robust high through put assembly process of light emitting diode arrays for wide area general lighting. Topics to be covered in this paper include the conceptual design, the flexible printed circuit substrate, flip chip assembly, yellow phosphor coating, and encapsulation. All these are integrated into one reel-to-reel assembly process. A prototype with the proposed process has been developed. A sample strip of packaged LED array has been produced as well. Recommendations for future industrial applications are also provided.

AB - The objective of the present study is to develop a robust high through put assembly process of light emitting diode arrays for wide area general lighting. Topics to be covered in this paper include the conceptual design, the flexible printed circuit substrate, flip chip assembly, yellow phosphor coating, and encapsulation. All these are integrated into one reel-to-reel assembly process. A prototype with the proposed process has been developed. A sample strip of packaged LED array has been produced as well. Recommendations for future industrial applications are also provided.

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UR - https://www.scopus.com/pages/publications/64049116064

U2 - 10.1109/EMAP.2008.4784277

DO - 10.1109/EMAP.2008.4784277

M3 - Conference Paper published in a book

SN - 9781424436217

T3 - 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008

SP - 255

EP - 258

BT - 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008

T2 - 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008

Y2 - 22 October 2008 through 24 October 2008

ER -

Lee SWR, Tong YW, Chan YS, Lo JCC, Zhang R. Development of surface mount compatible reel-to-reel assembly process of LED arrays for wide area general lighting. In 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008. 2008. p. 255-258. 4784277. (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008). doi: 10.1109/EMAP.2008.4784277

Development of surface mount compatible reel-to-reel assembly process of LED arrays for wide area general lighting

Abstract

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