Device degradation of n-channel poly-Si TFT's due to high-field, hot-carrier and radiation stressing

A. Khamesra, R. Lal, J. Vasi*, K. P.A. Kumar, J. K.O. Sin

*Corresponding author for this work

Research output: Contribution to conferenceConference Paperpeer-review

9 Citations (Scopus)

Abstract

Degradation in low-temperature poly-Si TFT devices was studied for high-field stressing hot-carrier stressing as well as gamma radiation stressing. It was found that degradation is dominated by electron trapping in the gate oxide that causes a parallel rightward shift in the transfer curves. The other probable mechanisms involved include generation of mid-gap defects in the bulk polysilicon and creation of mid-gap defects in the bulk polysilicon and creation of interface states at the Si/SiO2 interface.

Original languageEnglish
Pages258-262
Number of pages5
Publication statusPublished - 2001
Externally publishedYes
Event8th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2001) - Singapure, Singapore
Duration: 9 Jul 200113 Jul 2001

Conference

Conference8th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2001)
Country/TerritorySingapore
CitySingapure
Period9/07/0113/07/01

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