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Device degradation of n-channel poly-Si TFT's due to high-field, hot-carrier and radiation stressing

  • A. Khamesra
  • , R. Lal
  • , J. Vasi*
  • , K. P.A. Kumar
  • , J. K.O. Sin
  • *Corresponding author for this work

Research output: Contribution to conference › Conference Paper › peer-review

Abstract

Degradation in low-temperature poly-Si TFT devices was studied for high-field stressing hot-carrier stressing as well as gamma radiation stressing. It was found that degradation is dominated by electron trapping in the gate oxide that causes a parallel rightward shift in the transfer curves. The other probable mechanisms involved include generation of mid-gap defects in the bulk polysilicon and creation of mid-gap defects in the bulk polysilicon and creation of interface states at the Si/SiO2 interface.

Original languageEnglish
Pages258-262
Number of pages5
Publication statusPublished - 2001
Externally publishedYes
Event8th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2001) - Singapure, Singapore
Duration: 9 Jul 2001 → 13 Jul 2001

Conference

Conference8th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2001)
Country/TerritorySingapore
CitySingapure
Period9/07/01 → 13/07/01

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