Directed electrostatic microassembly for microled display

Bradley B. Rupp; Lara S. Crawford; Jeng Ping Lu; Anne Plochowietz; Dave Biegelsen; Sourobh Raychaudhuri; Sergey Butylkov; Yunda Wang; Eugene M. Chow

doi:10.1002/sdtp.14815

Directed electrostatic microassembly for microled display

Bradley B. Rupp, Lara S. Crawford, Jeng Ping Lu, Anne Plochowietz, Dave Biegelsen, Sourobh Raychaudhuri, Sergey Butylkov, Yunda Wang, Eugene M. Chow

Research output: Contribution to journal › Conference article published in journal › peer-review

2 Citations (Scopus)

Abstract

We are developing a new chip integration tool based on massively parallel deterministic sorting and assembly, aiming to achieve the low cost of printing with the control of pick and place. Such a tool would enable scalable microLED display manufacturing and heterogeneous integration for advanced functionality. We describe a prototype system demonstrating continuous line by line assembly, and report single chip speed measurements of a centimeter per second, suggesting the approach could eventually support high throughput.

Original language	English
Pages (from-to)	845-848
Number of pages	4
Journal	Digest of Technical Papers - SID International Symposium
Volume	52
Issue number	1
DOIs	https://doi.org/10.1002/sdtp.14815
Publication status	Published - 2021
Externally published	Yes
Event	58th International Symposium on Digest of Technical Papers, ICDT 2021 - Virtual, Online Duration: 17 May 2021 → 21 May 2021

Bibliographical note

Publisher Copyright:
© 2021 SID.

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Keywords

Chiplets
Directed electrostatic assembly
Display
Flexible electronics
Heterogeneous integration
Mass transfer
Micro LED
Mini LED
Parallel control
Printed electronics
Sorting

Access to Document

10.1002/sdtp.14815

Cite this

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title = "Directed electrostatic microassembly for microled display",

abstract = "We are developing a new chip integration tool based on massively parallel deterministic sorting and assembly, aiming to achieve the low cost of printing with the control of pick and place. Such a tool would enable scalable microLED display manufacturing and heterogeneous integration for advanced functionality. We describe a prototype system demonstrating continuous line by line assembly, and report single chip speed measurements of a centimeter per second, suggesting the approach could eventually support high throughput.",

keywords = "Chiplets, Directed electrostatic assembly, Display, Flexible electronics, Heterogeneous integration, Mass transfer, Micro LED, Mini LED, Parallel control, Printed electronics, Sorting",

author = "Rupp, \{Bradley B.\} and Crawford, \{Lara S.\} and Lu, \{Jeng Ping\} and Anne Plochowietz and Dave Biegelsen and Sourobh Raychaudhuri and Sergey Butylkov and Yunda Wang and Chow, \{Eugene M.\}",

note = "Publisher Copyright: {\textcopyright} 2021 SID.; 58th International Symposium on Digest of Technical Papers, ICDT 2021 ; Conference date: 17-05-2021 Through 21-05-2021",

year = "2021",

doi = "10.1002/sdtp.14815",

language = "English",

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T1 - Directed electrostatic microassembly for microled display

AU - Rupp, Bradley B.

AU - Crawford, Lara S.

AU - Lu, Jeng Ping

AU - Plochowietz, Anne

AU - Biegelsen, Dave

AU - Raychaudhuri, Sourobh

AU - Butylkov, Sergey

AU - Wang, Yunda

AU - Chow, Eugene M.

PY - 2021

Y1 - 2021

N2 - We are developing a new chip integration tool based on massively parallel deterministic sorting and assembly, aiming to achieve the low cost of printing with the control of pick and place. Such a tool would enable scalable microLED display manufacturing and heterogeneous integration for advanced functionality. We describe a prototype system demonstrating continuous line by line assembly, and report single chip speed measurements of a centimeter per second, suggesting the approach could eventually support high throughput.

AB - We are developing a new chip integration tool based on massively parallel deterministic sorting and assembly, aiming to achieve the low cost of printing with the control of pick and place. Such a tool would enable scalable microLED display manufacturing and heterogeneous integration for advanced functionality. We describe a prototype system demonstrating continuous line by line assembly, and report single chip speed measurements of a centimeter per second, suggesting the approach could eventually support high throughput.

KW - Chiplets

KW - Directed electrostatic assembly

KW - Display

KW - Flexible electronics

KW - Heterogeneous integration

KW - Mass transfer

KW - Micro LED

KW - Mini LED

KW - Parallel control

KW - Printed electronics

KW - Sorting

UR - https://www.scopus.com/pages/publications/85113884549

U2 - 10.1002/sdtp.14815

DO - 10.1002/sdtp.14815

M3 - Conference article published in journal

AN - SCOPUS:85113884549

SN - 0097-966X

VL - 52

SP - 845

EP - 848

JO - Digest of Technical Papers - SID International Symposium

JF - Digest of Technical Papers - SID International Symposium

IS - 1

T2 - 58th International Symposium on Digest of Technical Papers, ICDT 2021

Y2 - 17 May 2021 through 21 May 2021

ER -

Directed electrostatic microassembly for microled display

Abstract

Bibliographical note

UN SDGs

Keywords

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