TY - JOUR
T1 - Effect of heat-spreader sizes on the thermal performance of large cavity-down plastic ball grid array packages
AU - Lau, J.
AU - Chen, T.
AU - Lee, S. W.R.
PY - 1999/12
Y1 - 1999/12
N2 - The effect of heat-spreader sizes on the temperature distribution, thermal resistance, and cooling power of a set of cost-effective cavity-down plastic ball grid array (PBGA) packages assembled on a FR-4 epoxy glass printed circuit board (PCB) is presented. The sizes of these packages are 35 X 35 mm and 40 X 40 mm with 4 and 5 rows of solder balls.
AB - The effect of heat-spreader sizes on the temperature distribution, thermal resistance, and cooling power of a set of cost-effective cavity-down plastic ball grid array (PBGA) packages assembled on a FR-4 epoxy glass printed circuit board (PCB) is presented. The sizes of these packages are 35 X 35 mm and 40 X 40 mm with 4 and 5 rows of solder balls.
UR - https://www.webofscience.com/wos/woscc/full-record/WOS:000084593400005
UR - https://openalex.org/W1975761407
UR - https://www.scopus.com/pages/publications/0012041557
U2 - 10.1115/1.2793847
DO - 10.1115/1.2793847
M3 - Journal Article
SN - 1043-7398
VL - 121
SP - 242
EP - 248
JO - Journal of Electronic Packaging, Transactions of the ASME
JF - Journal of Electronic Packaging, Transactions of the ASME
IS - 4
ER -