Effects of plasma cleaning on the reliability of wire bonding

J. M. Nowful; S. C. Lok; S. W. Ricky Lee

doi:10.1109/EMAP.2001.983955

Effects of plasma cleaning on the reliability of wire bonding

J. M. Nowful, S. C. Lok, S. W. Ricky Lee

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

23 Citations (Scopus)

Abstract

The yield of wire bonding predominantly depends on the surface characteristics of wire bond pads. The contamination on bond pads may result in low ball shear/wire pull strength and poor strength uniformity. Therefore, it is essential to remove the contaminants from the bond pad surface prior to wire bonding. In the present study, the effects of plasma cleaning on the reliability of wire bonding are investigated. Two types of plasma cleaning with various processing parameters are studied. Besides, specimens without plasma cleaning are also investigated for benchmarking. In addition to the comparison of contact angle, both ball shear and wire pull tests are performed to evaluate the effects of plasma cleaning. From the experimental data, it is observed that the plasma cleaning with proper parameter tuning can improve the contact angle characteristics and the reliability of wire bonding. However, a certain type of plasma cleaning may reduce the ball shear strength. Further analytical inspection is conducted on the bond pad surface. Detailed composition characterization is performed to confirm the findings of the present study.

Original language	English
Title of host publication	Advances in Electronic Materials and Packaging 2001
Editors	S.B. Lee, K.W. Paik
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	39-43
Number of pages	5
ISBN (Electronic)	0780371577, 9780780371576
DOIs	https://doi.org/10.1109/EMAP.2001.983955
Publication status	Published - 2001
Event	3rd International Symposium on Electronic Materials and Packaging, EMAP 2001 - Jeju Island, Korea, Republic of Duration: 19 Nov 2001 → 22 Nov 2001

Publication series

Name	Advances in Electronic Materials and Packaging 2001

Conference

Conference	3rd International Symposium on Electronic Materials and Packaging, EMAP 2001
Country/Territory	Korea, Republic of
City	Jeju Island
Period	19/11/01 → 22/11/01

Bibliographical note

Publisher Copyright:
© 2001 IEEE.

Access to Document

10.1109/EMAP.2001.983955

Cite this

Nowful, J. M., Lok, S. C., & Ricky Lee, S. W. (2001). Effects of plasma cleaning on the reliability of wire bonding. In S. B. Lee, & K. W. Paik (Eds.), Advances in Electronic Materials and Packaging 2001 (pp. 39-43). Article 983955 (Advances in Electronic Materials and Packaging 2001). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EMAP.2001.983955

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title = "Effects of plasma cleaning on the reliability of wire bonding",

abstract = "The yield of wire bonding predominantly depends on the surface characteristics of wire bond pads. The contamination on bond pads may result in low ball shear/wire pull strength and poor strength uniformity. Therefore, it is essential to remove the contaminants from the bond pad surface prior to wire bonding. In the present study, the effects of plasma cleaning on the reliability of wire bonding are investigated. Two types of plasma cleaning with various processing parameters are studied. Besides, specimens without plasma cleaning are also investigated for benchmarking. In addition to the comparison of contact angle, both ball shear and wire pull tests are performed to evaluate the effects of plasma cleaning. From the experimental data, it is observed that the plasma cleaning with proper parameter tuning can improve the contact angle characteristics and the reliability of wire bonding. However, a certain type of plasma cleaning may reduce the ball shear strength. Further analytical inspection is conducted on the bond pad surface. Detailed composition characterization is performed to confirm the findings of the present study.",

author = "Nowful, \{J. M.\} and Lok, \{S. C.\} and \{Ricky Lee\}, \{S. W.\}",

note = "Publisher Copyright: {\textcopyright} 2001 IEEE.; 3rd International Symposium on Electronic Materials and Packaging, EMAP 2001 ; Conference date: 19-11-2001 Through 22-11-2001",

year = "2001",

doi = "10.1109/EMAP.2001.983955",

language = "English",

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publisher = "Institute of Electrical and Electronics Engineers Inc.",

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Nowful, JM, Lok, SC & Ricky Lee, SW 2001, Effects of plasma cleaning on the reliability of wire bonding. in SB Lee & KW Paik (eds), Advances in Electronic Materials and Packaging 2001., 983955, Advances in Electronic Materials and Packaging 2001, Institute of Electrical and Electronics Engineers Inc., pp. 39-43, 3rd International Symposium on Electronic Materials and Packaging, EMAP 2001, Jeju Island, Korea, Republic of, 19/11/01. https://doi.org/10.1109/EMAP.2001.983955

Effects of plasma cleaning on the reliability of wire bonding. / Nowful, J. M.; Lok, S. C.; Ricky Lee, S. W.
Advances in Electronic Materials and Packaging 2001. ed. / S.B. Lee; K.W. Paik. Institute of Electrical and Electronics Engineers Inc., 2001. p. 39-43 983955 (Advances in Electronic Materials and Packaging 2001).

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

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AB - The yield of wire bonding predominantly depends on the surface characteristics of wire bond pads. The contamination on bond pads may result in low ball shear/wire pull strength and poor strength uniformity. Therefore, it is essential to remove the contaminants from the bond pad surface prior to wire bonding. In the present study, the effects of plasma cleaning on the reliability of wire bonding are investigated. Two types of plasma cleaning with various processing parameters are studied. Besides, specimens without plasma cleaning are also investigated for benchmarking. In addition to the comparison of contact angle, both ball shear and wire pull tests are performed to evaluate the effects of plasma cleaning. From the experimental data, it is observed that the plasma cleaning with proper parameter tuning can improve the contact angle characteristics and the reliability of wire bonding. However, a certain type of plasma cleaning may reduce the ball shear strength. Further analytical inspection is conducted on the bond pad surface. Detailed composition characterization is performed to confirm the findings of the present study.

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ER -

Effects of plasma cleaning on the reliability of wire bonding

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