TY - GEN
T1 - Electrochemical assembly and molecular dynamics simulation of SAM on copper for epoxy/copper adhesion improvement
AU - Kwok, Stephen C.T.
AU - Yuen, Matthew M.F.
PY - 2013
Y1 - 2013
N2 - This work reports on adhesion enhancement effects of self-assembled organothiol treatment on copper (Cu)/epoxy interface, as well as a significant reduction in treatment time under the influence of electric potential. The interfacial adhesion has 20-fold enhancement through the treatment due to improved linkage between copper substrate and epoxy layer by chemisorbed organothiol molecules. The treatment time was greatly reduced by a factor 32 from 16 hours to 30 minutes thanks to the electrical field assisted method without compromising the maximum adhesion strength, which was shown to be in order of 97.2Jm-2. Molecular Dynamics (MD) simulations were also carried out for studying the surface coverage effect of Self-assembly Monolayer (SAM) on Cu surface towards adhesion strength between Cuiepoxy interface. Simulation results together with experimental data were then used for explaining the adhesion promotion mechanism between Cu/epoxy interface.
AB - This work reports on adhesion enhancement effects of self-assembled organothiol treatment on copper (Cu)/epoxy interface, as well as a significant reduction in treatment time under the influence of electric potential. The interfacial adhesion has 20-fold enhancement through the treatment due to improved linkage between copper substrate and epoxy layer by chemisorbed organothiol molecules. The treatment time was greatly reduced by a factor 32 from 16 hours to 30 minutes thanks to the electrical field assisted method without compromising the maximum adhesion strength, which was shown to be in order of 97.2Jm-2. Molecular Dynamics (MD) simulations were also carried out for studying the surface coverage effect of Self-assembly Monolayer (SAM) on Cu surface towards adhesion strength between Cuiepoxy interface. Simulation results together with experimental data were then used for explaining the adhesion promotion mechanism between Cu/epoxy interface.
UR - https://www.scopus.com/pages/publications/84897786069
U2 - 10.1109/EPTC.2013.6745759
DO - 10.1109/EPTC.2013.6745759
M3 - Conference Paper published in a book
AN - SCOPUS:84897786069
SN - 9781479928330
T3 - Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
SP - 440
EP - 445
BT - Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
T2 - 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
Y2 - 11 December 2013 through 13 December 2013
ER -