Electrochemical synthesis of dendrite-like Cu catalysts for electroless deposition of Cu circuits

Zhe Zhong; Jinqi Xie; Kai Zhang; Matthew M.F. Yuen; Xian Zhu Fu; Rong Sun; Ching Ping Wong

doi:10.1109/ICEPT.2016.7583149

Electrochemical synthesis of dendrite-like Cu catalysts for electroless deposition of Cu circuits

Zhe Zhong, Jinqi Xie, Kai Zhang, Matthew M.F. Yuen, Xian Zhu Fu, Rong Sun, Ching Ping Wong

Department of Mechanical and Aerospace Engineering

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

Abstract

Dendrite-like Cu supported Pd catalysts were prepared for electroless deposition of Cu circuits. The as-preapred catalysts demonstrated excellent catalytic activity.

Original language	English
Title of host publication	2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016
Editors	Keyun Bi, Sheng Liu, Shengjun Zhou
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	341-343
Number of pages	3
ISBN (Electronic)	9781509013968
DOIs	https://doi.org/10.1109/ICEPT.2016.7583149
Publication status	Published - 4 Oct 2016
Event	17th International Conference on Electronic Packaging Technology, ICEPT 2016 - Wuhan, China Duration: 16 Aug 2016 → 19 Aug 2016

Publication series

Name	2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016

Conference

Conference	17th International Conference on Electronic Packaging Technology, ICEPT 2016
Country/Territory	China
City	Wuhan
Period	16/08/16 → 19/08/16

Bibliographical note

Publisher Copyright:
© 2016 IEEE.

Keywords

catalyst
circuit
dendrite-like Cu
electroless deposition
Pd coated Cu

Access to Document

10.1109/ICEPT.2016.7583149

Cite this

Zhong, Z., Xie, J., Zhang, K., Yuen, M. M. F., Fu, X. Z., Sun, R., & Wong, C. P. (2016). Electrochemical synthesis of dendrite-like Cu catalysts for electroless deposition of Cu circuits. In K. Bi, S. Liu, & S. Zhou (Eds.), 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016 (pp. 341-343). Article 7583149 (2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICEPT.2016.7583149

Zhong, Zhe ; Xie, Jinqi ; Zhang, Kai et al. / Electrochemical synthesis of dendrite-like Cu catalysts for electroless deposition of Cu circuits. 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016. editor / Keyun Bi ; Sheng Liu ; Shengjun Zhou. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 341-343 (2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016).

@inproceedings{48d9d4dc3e824e0cb06c9c693c9d13ca,

title = "Electrochemical synthesis of dendrite-like Cu catalysts for electroless deposition of Cu circuits",

abstract = "Dendrite-like Cu supported Pd catalysts were prepared for electroless deposition of Cu circuits. The as-preapred catalysts demonstrated excellent catalytic activity.",

keywords = "catalyst, circuit, dendrite-like Cu, electroless deposition, Pd coated Cu",

author = "Zhe Zhong and Jinqi Xie and Kai Zhang and Yuen, \{Matthew M.F.\} and Fu, \{Xian Zhu\} and Rong Sun and Wong, \{Ching Ping\}",

note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 17th International Conference on Electronic Packaging Technology, ICEPT 2016 ; Conference date: 16-08-2016 Through 19-08-2016",

year = "2016",

month = oct,

day = "4",

doi = "10.1109/ICEPT.2016.7583149",

language = "English",

series = "2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "341--343",

editor = "Keyun Bi and Sheng Liu and Shengjun Zhou",

booktitle = "2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016",

}

Zhong, Z, Xie, J, Zhang, K, Yuen, MMF, Fu, XZ, Sun, R & Wong, CP 2016, Electrochemical synthesis of dendrite-like Cu catalysts for electroless deposition of Cu circuits. in K Bi, S Liu & S Zhou (eds), 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016., 7583149, 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Institute of Electrical and Electronics Engineers Inc., pp. 341-343, 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 16/08/16. https://doi.org/10.1109/ICEPT.2016.7583149

Electrochemical synthesis of dendrite-like Cu catalysts for electroless deposition of Cu circuits. / Zhong, Zhe; Xie, Jinqi; Zhang, Kai et al.
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016. ed. / Keyun Bi; Sheng Liu; Shengjun Zhou. Institute of Electrical and Electronics Engineers Inc., 2016. p. 341-343 7583149 (2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016).

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

TY - GEN

T1 - Electrochemical synthesis of dendrite-like Cu catalysts for electroless deposition of Cu circuits

AU - Zhong, Zhe

AU - Xie, Jinqi

AU - Zhang, Kai

AU - Yuen, Matthew M.F.

AU - Fu, Xian Zhu

AU - Sun, Rong

AU - Wong, Ching Ping

PY - 2016/10/4

Y1 - 2016/10/4

N2 - Dendrite-like Cu supported Pd catalysts were prepared for electroless deposition of Cu circuits. The as-preapred catalysts demonstrated excellent catalytic activity.

AB - Dendrite-like Cu supported Pd catalysts were prepared for electroless deposition of Cu circuits. The as-preapred catalysts demonstrated excellent catalytic activity.

KW - catalyst

KW - circuit

KW - dendrite-like Cu

KW - electroless deposition

KW - Pd coated Cu

UR - https://www.scopus.com/pages/publications/84994137497

U2 - 10.1109/ICEPT.2016.7583149

DO - 10.1109/ICEPT.2016.7583149

M3 - Conference Paper published in a book

AN - SCOPUS:84994137497

T3 - 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016

SP - 341

EP - 343

BT - 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016

A2 - Bi, Keyun

A2 - Liu, Sheng

A2 - Zhou, Shengjun

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 17th International Conference on Electronic Packaging Technology, ICEPT 2016

Y2 - 16 August 2016 through 19 August 2016

ER -

Zhong Z, Xie J, Zhang K, Yuen MMF, Fu XZ, Sun R et al. Electrochemical synthesis of dendrite-like Cu catalysts for electroless deposition of Cu circuits. In Bi K, Liu S, Zhou S, editors, 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016. Institute of Electrical and Electronics Engineers Inc. 2016. p. 341-343. 7583149. (2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016). doi: 10.1109/ICEPT.2016.7583149

Electrochemical synthesis of dendrite-like Cu catalysts for electroless deposition of Cu circuits

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