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Electronic Materials and Packaging

  • Jang Kyo Kim
  • , R.S.W. Lee
  • , A. Teng

Research output: Book/ReportBook

Original languageEnglish
PublisherIEEE
ISBN (Print)0-7803-6654-9
Publication statusPublished - 2000

Publication series

NameProceedings of International Symposium Electronic Materials and Packaging

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