Feasibility study of fan-out panel-level packaging for heterogeneous integrations

Cheng Ta Ko, Henry Yang, John H. Lau, Ming Li, Curry Lin, Chieh Lin Chang, Jhih Yuan Pan, Hsing Hui Wu, Iris Xu, Tony Chen, Zhang Li, Kim Hwee Tan, Penny Lo, R. So, Y. H. Chen, Nelson Fan, Eric Kuah, Marc Lin, Y. M. Cheung, Eric NgCao Xi, Rozalia Beica, Sze Pei Lim, N. C. Lee, Mian Tao, Jeffery Lo, Ricky Lee

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

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