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Flow boiling heat transfer in wettability patterned microchannels

  • Bin Wang
  • , Minghao He
  • , Hongzhao Wang
  • , Huihe Qiu

Research output: Chapter in Book/Conference Proceeding/ReportConference Paper published in a bookpeer-review

Abstract

A wettability patterned surface has been developed to manipulate nucleation boiling in a micro fluid flow channel. The wettability patterns was fabricated by using hydrophobic dots on hydrophilic surfaces which form non-wetting islands and wetting network. The hydrophobic hexagon dots with a side length of 30μm and pitch distance 60μm are fabricated with Teflon (Teflon AF 400s2-100-1, DuPont) which has a contact angle of 120 degree. Experiments were conducted for flow boiling in a microchannel. The effects of wettability patterned surfaces on fluid flow, bubble generation and detachment in a microchannel will be visualized/measured utilizing micro resolution particle image velocimetry. The effects of surface patterns on bubble size, heat flux and heat transfer coefficient in flow boiling heat transfer processes were visualized by high speed camera and temperature sensors. It was found that on the wettability patterned surface, the temperature for onset nucleate boiling is about 6°C lower than that on the homogeneous surface while the heat transfer coefficient is about 70% higher than the hydrophilic surface. The results shows that the heat transfer can be significantly enhanced by wettability patterns in comparison with a hydrophilic surface under flow boiling conditions.

Original languageEnglish
Title of host publicationProceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages759-766
Number of pages8
ISBN (Electronic)9781509029945
DOIs
Publication statusPublished - 25 Jul 2017
Event16th IEEE InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017 - Orlando, United States
Duration: 30 May 20172 Jun 2017

Publication series

NameProceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017

Conference

Conference16th IEEE InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017
Country/TerritoryUnited States
CityOrlando
Period30/05/172/06/17

Bibliographical note

Publisher Copyright:
© 2017 IEEE.

Keywords

  • Bubble dynamics
  • Controlled nucleation sites
  • Enhance heat transfer
  • Flow boiling
  • Hydrophilic-hydrophobic patterns
  • Nucleation site density

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