Frictional effects of interface bonding energy in blister testing

M. Zheng; Y. J. Su; L. Q. Chen; T. Y. Zhang

doi:10.1016/S0167-8442(99)00028-2

Frictional effects of interface bonding energy in blister testing

M. Zheng, Y. J. Su, L. Q. Chen, T. Y. Zhang^*

^*Corresponding author for this work

Department of Mechanical and Aerospace Engineering

Research output: Contribution to journal › Journal Article › peer-review

13 Citations (Scopus)

Abstract

Blister tests are used to investigate the size effect on the critical energy release rate for the onset of debonding of interfaces between commercial tape and plain steel. The measured data display a size effect if the interfacial friction is not taken into account. A proportional displacement model is thus proposed to simultaneously evaluate the critical energy release rate and the frictional parameter. Theory and experiment give a critical energy release rate of 1.9956 Pa m for the onset of interfacial debonding between the commercial tape and the plain steel and it is independent of the blister size.

Original language	English
Pages (from-to)	75-80
Number of pages	6
Journal	Theoretical and Applied Fracture Mechanics
Volume	32
Issue number	2
DOIs	https://doi.org/10.1016/S0167-8442(99)00028-2
Publication status	Published - 1999

Keywords

Blister
Bonding energy
Critical energy release rate
Frictional effect
Interface

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10.1016/S0167-8442(99)00028-2

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title = "Frictional effects of interface bonding energy in blister testing",

abstract = "Blister tests are used to investigate the size effect on the critical energy release rate for the onset of debonding of interfaces between commercial tape and plain steel. The measured data display a size effect if the interfacial friction is not taken into account. A proportional displacement model is thus proposed to simultaneously evaluate the critical energy release rate and the frictional parameter. Theory and experiment give a critical energy release rate of 1.9956 Pa m for the onset of interfacial debonding between the commercial tape and the plain steel and it is independent of the blister size.",

keywords = "Blister, Bonding energy, Critical energy release rate, Frictional effect, Interface",

author = "M. Zheng and Su, \{Y. J.\} and Chen, \{L. Q.\} and Zhang, \{T. Y.\}",

year = "1999",

doi = "10.1016/S0167-8442(99)00028-2",

language = "English",

volume = "32",

pages = "75--80",

journal = "Theoretical and Applied Fracture Mechanics",

issn = "0167-8442",

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TY - JOUR

T1 - Frictional effects of interface bonding energy in blister testing

AU - Zheng, M.

AU - Su, Y. J.

AU - Chen, L. Q.

AU - Zhang, T. Y.

PY - 1999

Y1 - 1999

N2 - Blister tests are used to investigate the size effect on the critical energy release rate for the onset of debonding of interfaces between commercial tape and plain steel. The measured data display a size effect if the interfacial friction is not taken into account. A proportional displacement model is thus proposed to simultaneously evaluate the critical energy release rate and the frictional parameter. Theory and experiment give a critical energy release rate of 1.9956 Pa m for the onset of interfacial debonding between the commercial tape and the plain steel and it is independent of the blister size.

AB - Blister tests are used to investigate the size effect on the critical energy release rate for the onset of debonding of interfaces between commercial tape and plain steel. The measured data display a size effect if the interfacial friction is not taken into account. A proportional displacement model is thus proposed to simultaneously evaluate the critical energy release rate and the frictional parameter. Theory and experiment give a critical energy release rate of 1.9956 Pa m for the onset of interfacial debonding between the commercial tape and the plain steel and it is independent of the blister size.

KW - Blister

KW - Bonding energy

KW - Critical energy release rate

KW - Frictional effect

KW - Interface

UR - https://www.webofscience.com/wos/woscc/full-record/WOS:000083742800001

UR - https://openalex.org/W2048530497

UR - https://www.scopus.com/pages/publications/0033189606

U2 - 10.1016/S0167-8442(99)00028-2

DO - 10.1016/S0167-8442(99)00028-2

M3 - Journal Article

SN - 0167-8442

VL - 32

SP - 75

EP - 80

JO - Theoretical and Applied Fracture Mechanics

JF - Theoretical and Applied Fracture Mechanics

IS - 2

ER -

Frictional effects of interface bonding energy in blister testing

Abstract

Keywords

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