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High performance electrical conductive composites with ultralow percolation threshold

  • Xinfeng Zhang*
  • , Matthew Ming Fai Yuen
  • *Corresponding author for this work

Research output: Chapter in Book/Conference Proceeding/ReportConference Paper published in a bookpeer-review

Abstract

Particle-laiden polymer composites are a broad range of functional materials. Most of the polymer composite properties are strongly dependent on the filler loading level, which typically have an abrupt change near the critical filler loading. This phenomenon has been widely investigated and theoretically modeled by percolation theory. Generally, controlling the percolation threshold became a dominating approach to adjust the percolation properties of a composite and have attracted intensive interests. Here we report a generized strategy to control over the percolative properties in polymer composite. The percolation threshold of the composite <4 v% was demonstrated in polymer composite by using the commercially available microparticles, comparing to a threshold value of ∼18 v% in a conventional composite. For the electrically conductive composite, a reduction of 40 wt% of filler loading was achieved while keeping its conductivity. The percolation threshold controls not only increase the percolation properties of the electrical conductivity, but also the thermal conductivity and dielectric properties of the composites. The strategy described can be implemented in most of the current polymer composite manufacturing processes. The findings reported here are expected to revolutionize the conventional fields of composite materials.

Original languageEnglish
Title of host publication2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014
EditorsKeyun Bi, Zhong Tian, Ziqiang Xu
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages306-309
Number of pages4
ISBN (Electronic)9781479947072
DOIs
Publication statusPublished - 13 Oct 2014
Event2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014 - Chengdu, China
Duration: 12 Aug 201415 Aug 2014

Publication series

NameProceedings of the Electronic Packaging Technology Conference, EPTC

Conference

Conference2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014
Country/TerritoryChina
CityChengdu
Period12/08/1415/08/14

Bibliographical note

Publisher Copyright:
© 2014 IEEE.

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

  1. SDG 9 - Industry, Innovation, and Infrastructure
    SDG 9 Industry, Innovation, and Infrastructure

Keywords

  • capillary force
  • electrical conductive composite
  • jamming
  • percolation

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