Abstract
Particle-laiden polymer composites are a broad range of functional materials. Most of the polymer composite properties are strongly dependent on the filler loading level, which typically have an abrupt change near the critical filler loading. This phenomenon has been widely investigated and theoretically modeled by percolation theory. Generally, controlling the percolation threshold became a dominating approach to adjust the percolation properties of a composite and have attracted intensive interests. Here we report a generized strategy to control over the percolative properties in polymer composite. The percolation threshold of the composite <4 v% was demonstrated in polymer composite by using the commercially available microparticles, comparing to a threshold value of ∼18 v% in a conventional composite. For the electrically conductive composite, a reduction of 40 wt% of filler loading was achieved while keeping its conductivity. The percolation threshold controls not only increase the percolation properties of the electrical conductivity, but also the thermal conductivity and dielectric properties of the composites. The strategy described can be implemented in most of the current polymer composite manufacturing processes. The findings reported here are expected to revolutionize the conventional fields of composite materials.
| Original language | English |
|---|---|
| Title of host publication | 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014 |
| Editors | Keyun Bi, Zhong Tian, Ziqiang Xu |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 306-309 |
| Number of pages | 4 |
| ISBN (Electronic) | 9781479947072 |
| DOIs | |
| Publication status | Published - 13 Oct 2014 |
| Event | 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014 - Chengdu, China Duration: 12 Aug 2014 → 15 Aug 2014 |
Publication series
| Name | Proceedings of the Electronic Packaging Technology Conference, EPTC |
|---|
Conference
| Conference | 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014 |
|---|---|
| Country/Territory | China |
| City | Chengdu |
| Period | 12/08/14 → 15/08/14 |
Bibliographical note
Publisher Copyright:© 2014 IEEE.
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 9 Industry, Innovation, and Infrastructure
Keywords
- capillary force
- electrical conductive composite
- jamming
- percolation
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