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High throughput roller type nano-pattern transfer technique on both rigid flexible substrates and mold deformation analysis under atmospheric imprint environment

  • Yinsheng Zhong*
  • , Matthew M.F. Yuen
  • *Corresponding author for this work

Research output: Chapter in Book/Conference Proceeding/ReportConference Paper published in a bookpeer-review

Abstract

This paper provides a roller type nano-pattern transfer process, which is based on UV nanoimprint lithography, for nano-patterning on both rigid and flexible substrates. By using UV-curable polymer resist, room temperature and low pressure process, which is possible to apply to flexible films, is introduced. PDMS and PVA soft molds that can have conformal contact with large area non-flat substrate surface are fabricated. The nano-scale mold patterns are duplicated from Si wafer after E-beam lithography and DRIE dry etching. A homemade roller type printing machine with an elastic buffer layer is designed and fabricated to achieve uniform printing results over entire working area. High-throughput printing process with printing speed up to 50 mm/s is demonstrated. Glass, Si wafer and PET film were tested as printing substrates. Micro and nano-patterns were transferred clearly to the polymer layer on substrates. Images from optical microscope, SEM and AFM were used to evaluate the transferred nano-patterns. Detail process flow, including mold fabrication, is described. The governing parameters in the process are discussed. Simulation and theoretical analysis on the mold deformation under atmosphere imprint environment is studied. The effect of surface property during the pattern transfer process is identified.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1822-1827
Number of pages6
ISBN (Electronic)9781479924073
DOIs
Publication statusPublished - 11 Sept 2014
Event64th Electronic Components and Technology Conference, ECTC 2014 - Orlando, United States
Duration: 27 May 201430 May 2014

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Conference

Conference64th Electronic Components and Technology Conference, ECTC 2014
Country/TerritoryUnited States
CityOrlando
Period27/05/1430/05/14

Bibliographical note

Publisher Copyright:
© 2014 IEEE.

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