Hot-carrier-reliability of mixed analog/digital technologies

Khandker N. Quader; Wilson Y. Chan; Ping K. Ko; Chenming Hu

doi:10.1109/VTSA.1993.263652

Hot-carrier-reliability of mixed analog/digital technologies

Khandker N. Quader, Wilson Y. Chan, Ping K. Ko, Chenming Hu

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

5 Citations (Scopus)

Abstract

DC lifetime, in conjunction with speed and time factors, can be used to predict digital circuit hot-carrier lifetime. Analog circuit reliability prediction, on the other hand, has to take analog design variables such as channel length, biasing conditions, and circuit topography into consideration. We propose a new methodology for predicting analog circuit reliability. Instead of the traditional lifetime plots, we present a set of analog hot-carrier design curves that span the analog design space. The design curves will become increasingly important for high speed analog applications and for ULSI chips that integrate a wide variety of analog and digital functions. The design curves can be used to quickly estimate the hot-carrier sensitivity of a particular analog sub-block and to adjust the design variables for better hot-carrier immunity.

Original language	English
Title of host publication	1993 International Symposium on VLSI Technology, Systems, and Applications, VLSI-TSA 1993 - Proceedings of Technical Papers
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	168-172
Number of pages	5
ISBN (Electronic)	0780309782
DOIs	https://doi.org/10.1109/VTSA.1993.263652
Publication status	Published - 1993
Externally published	Yes
Event	1993 International Symposium on VLSI Technology, Systems, and Applications, VLSI-TSA 1993 - Taipei, Taiwan, Province of China Duration: 12 May 1993 → 14 May 1993

Publication series

Name	International Symposium on VLSI Technology, Systems, and Applications, Proceedings
ISSN (Print)	1930-8868

Conference

Conference	1993 International Symposium on VLSI Technology, Systems, and Applications, VLSI-TSA 1993
Country/Territory	Taiwan, Province of China
City	Taipei
Period	12/05/93 → 14/05/93

Bibliographical note

Publisher Copyright:
© 1993 IEEE.

Access to Document

10.1109/VTSA.1993.263652

Cite this

Quader, K. N., Chan, W. Y., Ko, P. K., & Hu, C. (1993). Hot-carrier-reliability of mixed analog/digital technologies. In 1993 International Symposium on VLSI Technology, Systems, and Applications, VLSI-TSA 1993 - Proceedings of Technical Papers (pp. 168-172). Article 263652 (International Symposium on VLSI Technology, Systems, and Applications, Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/VTSA.1993.263652

Quader, Khandker N. ; Chan, Wilson Y. ; Ko, Ping K. et al. / Hot-carrier-reliability of mixed analog/digital technologies. 1993 International Symposium on VLSI Technology, Systems, and Applications, VLSI-TSA 1993 - Proceedings of Technical Papers. Institute of Electrical and Electronics Engineers Inc., 1993. pp. 168-172 (International Symposium on VLSI Technology, Systems, and Applications, Proceedings).

@inproceedings{fa85fa5217824da4a3c35529cf407692,

title = "Hot-carrier-reliability of mixed analog/digital technologies",

abstract = "DC lifetime, in conjunction with speed and time factors, can be used to predict digital circuit hot-carrier lifetime. Analog circuit reliability prediction, on the other hand, has to take analog design variables such as channel length, biasing conditions, and circuit topography into consideration. We propose a new methodology for predicting analog circuit reliability. Instead of the traditional lifetime plots, we present a set of analog hot-carrier design curves that span the analog design space. The design curves will become increasingly important for high speed analog applications and for ULSI chips that integrate a wide variety of analog and digital functions. The design curves can be used to quickly estimate the hot-carrier sensitivity of a particular analog sub-block and to adjust the design variables for better hot-carrier immunity.",

author = "Quader, \{Khandker N.\} and Chan, \{Wilson Y.\} and Ko, \{Ping K.\} and Chenming Hu",

note = "Publisher Copyright: {\textcopyright} 1993 IEEE.; 1993 International Symposium on VLSI Technology, Systems, and Applications, VLSI-TSA 1993 ; Conference date: 12-05-1993 Through 14-05-1993",

year = "1993",

doi = "10.1109/VTSA.1993.263652",

language = "English",

series = "International Symposium on VLSI Technology, Systems, and Applications, Proceedings",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "168--172",

booktitle = "1993 International Symposium on VLSI Technology, Systems, and Applications, VLSI-TSA 1993 - Proceedings of Technical Papers",

}

Quader, KN, Chan, WY, Ko, PK & Hu, C 1993, Hot-carrier-reliability of mixed analog/digital technologies. in 1993 International Symposium on VLSI Technology, Systems, and Applications, VLSI-TSA 1993 - Proceedings of Technical Papers., 263652, International Symposium on VLSI Technology, Systems, and Applications, Proceedings, Institute of Electrical and Electronics Engineers Inc., pp. 168-172, 1993 International Symposium on VLSI Technology, Systems, and Applications, VLSI-TSA 1993, Taipei, Taiwan, Province of China, 12/05/93. https://doi.org/10.1109/VTSA.1993.263652

Hot-carrier-reliability of mixed analog/digital technologies. / Quader, Khandker N.; Chan, Wilson Y.; Ko, Ping K. et al.
1993 International Symposium on VLSI Technology, Systems, and Applications, VLSI-TSA 1993 - Proceedings of Technical Papers. Institute of Electrical and Electronics Engineers Inc., 1993. p. 168-172 263652 (International Symposium on VLSI Technology, Systems, and Applications, Proceedings).

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

TY - GEN

T1 - Hot-carrier-reliability of mixed analog/digital technologies

AU - Quader, Khandker N.

AU - Chan, Wilson Y.

AU - Ko, Ping K.

AU - Hu, Chenming

PY - 1993

Y1 - 1993

N2 - DC lifetime, in conjunction with speed and time factors, can be used to predict digital circuit hot-carrier lifetime. Analog circuit reliability prediction, on the other hand, has to take analog design variables such as channel length, biasing conditions, and circuit topography into consideration. We propose a new methodology for predicting analog circuit reliability. Instead of the traditional lifetime plots, we present a set of analog hot-carrier design curves that span the analog design space. The design curves will become increasingly important for high speed analog applications and for ULSI chips that integrate a wide variety of analog and digital functions. The design curves can be used to quickly estimate the hot-carrier sensitivity of a particular analog sub-block and to adjust the design variables for better hot-carrier immunity.

AB - DC lifetime, in conjunction with speed and time factors, can be used to predict digital circuit hot-carrier lifetime. Analog circuit reliability prediction, on the other hand, has to take analog design variables such as channel length, biasing conditions, and circuit topography into consideration. We propose a new methodology for predicting analog circuit reliability. Instead of the traditional lifetime plots, we present a set of analog hot-carrier design curves that span the analog design space. The design curves will become increasingly important for high speed analog applications and for ULSI chips that integrate a wide variety of analog and digital functions. The design curves can be used to quickly estimate the hot-carrier sensitivity of a particular analog sub-block and to adjust the design variables for better hot-carrier immunity.

UR - https://www.scopus.com/pages/publications/33746946701

U2 - 10.1109/VTSA.1993.263652

DO - 10.1109/VTSA.1993.263652

M3 - Conference Paper published in a book

AN - SCOPUS:33746946701

T3 - International Symposium on VLSI Technology, Systems, and Applications, Proceedings

SP - 168

EP - 172

BT - 1993 International Symposium on VLSI Technology, Systems, and Applications, VLSI-TSA 1993 - Proceedings of Technical Papers

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 1993 International Symposium on VLSI Technology, Systems, and Applications, VLSI-TSA 1993

Y2 - 12 May 1993 through 14 May 1993

ER -

Quader KN, Chan WY, Ko PK, Hu C. Hot-carrier-reliability of mixed analog/digital technologies. In 1993 International Symposium on VLSI Technology, Systems, and Applications, VLSI-TSA 1993 - Proceedings of Technical Papers. Institute of Electrical and Electronics Engineers Inc. 1993. p. 168-172. 263652. (International Symposium on VLSI Technology, Systems, and Applications, Proceedings). doi: 10.1109/VTSA.1993.263652

Hot-carrier-reliability of mixed analog/digital technologies

Abstract

Publication series

Conference

Bibliographical note

Access to Document

Other files and links

Fingerprint

Cite this