How to assemble large PBGAs on PCB reliably with large PQFPs directly on the opposite side?

J. H. Lau; R. Lee; H. Chao

How to assemble large PBGAs on PCB reliably with large PQFPs directly on the opposite side?

J. H. Lau^*, R. Lee, H. Chao

^*Corresponding author for this work

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review

Abstract

A two-side no clean mass reflow process for large plastic ball grid array (PBGA) and plastic quad flat pack (PQFP) packages is presented. Emphasis is placed on the PBGA and PQFP assembly parameters such as the design, material, and process of the packages and printed circuit board (PCB), solder paste, stencil printing, pick and place, reflow, and inspection. Solder joint reliability of the two-side PCB assembly is evaluated by shear tests and thermal cycling tests.

Original language	English
Title of host publication	Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
Publisher	IEEE
Pages	448-456
Number of pages	9
ISBN (Print)	0780355032, 9780780355033
Publication status	Published - 1999
Event	Proceedings of the 1999 24th IEEE/CPMT International Electronics Manufacturing Technology Symposium (IEMT 1999) - Austin, TX, USA Duration: 18 Oct 1999 → 19 Oct 1999

Publication series

Name	Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
ISSN (Print)	1089-8190

Conference

Conference	Proceedings of the 1999 24th IEEE/CPMT International Electronics Manufacturing Technology Symposium (IEMT 1999)
City	Austin, TX, USA
Period	18/10/99 → 19/10/99

Cite this

@inproceedings{40a5b0692b674cf084443b0c8ec16b67,

title = "How to assemble large PBGAs on PCB reliably with large PQFPs directly on the opposite side?",

abstract = "A two-side no clean mass reflow process for large plastic ball grid array (PBGA) and plastic quad flat pack (PQFP) packages is presented. Emphasis is placed on the PBGA and PQFP assembly parameters such as the design, material, and process of the packages and printed circuit board (PCB), solder paste, stencil printing, pick and place, reflow, and inspection. Solder joint reliability of the two-side PCB assembly is evaluated by shear tests and thermal cycling tests.",

author = "Lau, \{J. H.\} and R. Lee and H. Chao",

year = "1999",

language = "English",

isbn = "0780355032",

series = "Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium",

publisher = "IEEE",

pages = "448--456",

booktitle = "Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium",

note = "Proceedings of the 1999 24th IEEE/CPMT International Electronics Manufacturing Technology Symposium (IEMT 1999) ; Conference date: 18-10-1999 Through 19-10-1999",

}

Lau, JH, Lee, R & Chao, H 1999, How to assemble large PBGAs on PCB reliably with large PQFPs directly on the opposite side? in Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, IEEE, pp. 448-456, Proceedings of the 1999 24th IEEE/CPMT International Electronics Manufacturing Technology Symposium (IEMT 1999), Austin, TX, USA, 18/10/99.

How to assemble large PBGAs on PCB reliably with large PQFPs directly on the opposite side? / Lau, J. H.; Lee, R.; Chao, H.
Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. IEEE, 1999. p. 448-456 (Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium).

Research output: Chapter in Book/Conference Proceeding/Report › Conference Paper published in a book › peer-review