Improved blocking capability of N-ion-implanted β-Ga2O3 U-shaped trench gate MOSFET by annealing in oxygen

Qi Liu, Jingbo Zhou, Xuanze Zhou*, Man Hoi Wong, Huidong Yao, Jinyang Liu, Xiaodong Zhang*, Guangwei Xu*, Shibing Long

*Corresponding author for this work

Research output: Contribution to journalJournal Articlepeer-review

3 Citations (Scopus)

Abstract

To improve the blocking capability of U-shaped trench gate MOSFETs (UMOSFETs) based on nitrogen-implanted current blocking layer (CBL), the post-implantation annealing atmosphere is optimized. Compared to the UMOSFET annealed in nitrogen, the oxygen-annealed device shows an improved breakdown voltage, increasing from 830 V to 1330 V, while maintaining similar specific on-resistance. By analyzing the leakage mechanisms of CBLs, the lower leakage current in the oxygen-annealed device is attributed to the reduced concentration of certain deep donors and the change in trap energy level involved in the Poole-Frenkel (PF) emission. This work validates oxygen annealing as an effective approach to optimizing nitrogen-implanted β-Ga2O3 power MOSFETs.

Original languageEnglish
Article number041003
JournalApplied Physics Express
Volume18
Issue number4
DOIs
Publication statusPublished - 1 Apr 2025

Bibliographical note

Publisher Copyright:
© 2025 The Author(s). Published on behalf of The Japan Society of Applied Physics by IOP Publishing Ltd.

Keywords

  • GaO
  • enhancement mode
  • ion implantation
  • vertical MOSFET

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