Abstract
To improve the blocking capability of U-shaped trench gate MOSFETs (UMOSFETs) based on nitrogen-implanted current blocking layer (CBL), the post-implantation annealing atmosphere is optimized. Compared to the UMOSFET annealed in nitrogen, the oxygen-annealed device shows an improved breakdown voltage, increasing from 830 V to 1330 V, while maintaining similar specific on-resistance. By analyzing the leakage mechanisms of CBLs, the lower leakage current in the oxygen-annealed device is attributed to the reduced concentration of certain deep donors and the change in trap energy level involved in the Poole-Frenkel (PF) emission. This work validates oxygen annealing as an effective approach to optimizing nitrogen-implanted β-Ga2O3 power MOSFETs.
| Original language | English |
|---|---|
| Article number | 041003 |
| Journal | Applied Physics Express |
| Volume | 18 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - 1 Apr 2025 |
Bibliographical note
Publisher Copyright:© 2025 The Author(s). Published on behalf of The Japan Society of Applied Physics by IOP Publishing Ltd.
Keywords
- GaO
- enhancement mode
- ion implantation
- vertical MOSFET