Improved surface morphology and mobility of AlGaN/GaN HEMT grown on silicon substrate

Xueliang Zhu, Jun Ma, Tongde Huang, Ming Li, Ka Ming Wong, Kei May Lau*

*Corresponding author for this work

Research output: Contribution to journalJournal Articlepeer-review

Abstract

High mobility AlGaN/GaN HEMT was grown on silicon substrates by MOCVD. Smooth and crack-free wafers were obtained by implementation of an AlN/AlGaN super-lattice interlayer. We also found that the carrier gases have a great influence on the surface morphology of the AlGaN barrier. With a proper ratio of carrier gases, the AlGaN surface is significantly improved. With other optimized growth conditions, the electron mobility of HEMT can be as high as 1650 cm 2/Vs. HEMT devices are also fabricatied and the reverse biased gate leakage current was reduced to 6.5 μA/mm at V gs = -35 V.

Original languageEnglish
Pages (from-to)473-475
Number of pages3
JournalPhysica Status Solidi (C) Current Topics in Solid State Physics
Volume9
Issue number3-4
DOIs
Publication statusPublished - Mar 2012

Keywords

  • GaN HEMT
  • MOCVD
  • Reverse leakage current

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