Abstract
High mobility AlGaN/GaN HEMT was grown on silicon substrates by MOCVD. Smooth and crack-free wafers were obtained by implementation of an AlN/AlGaN super-lattice interlayer. We also found that the carrier gases have a great influence on the surface morphology of the AlGaN barrier. With a proper ratio of carrier gases, the AlGaN surface is significantly improved. With other optimized growth conditions, the electron mobility of HEMT can be as high as 1650 cm 2/Vs. HEMT devices are also fabricatied and the reverse biased gate leakage current was reduced to 6.5 μA/mm at V gs = -35 V.
| Original language | English |
|---|---|
| Pages (from-to) | 473-475 |
| Number of pages | 3 |
| Journal | Physica Status Solidi (C) Current Topics in Solid State Physics |
| Volume | 9 |
| Issue number | 3-4 |
| DOIs | |
| Publication status | Published - Mar 2012 |
Keywords
- GaN HEMT
- MOCVD
- Reverse leakage current
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