Interface engineering to enhance phase change memory programmability

Yihan Chen, Mansun Chan, Xinnan Lin, Zhitong Song

Research output: Chapter in Book/Conference Proceeding/ReportConference Paper published in a bookpeer-review

Abstract

Despite the promise for resistive phase-change memory to be used in the BEOL memory integration, achieving low current programming and rapid thermal cycle management are still the main barriers in term of operation. In this work, different methods to reduce the programming current are examined with respect to their effects on thermal cycling during SET and RESET. In particular, the discussion will focus on the engineering of the electrode to phase-change material interface to achieve low programming current. Experimental demonstration and thermal simulation data are used to illustrate the concept and explain the device behaviors.

Original languageEnglish
Title of host publicationProceedings of the 2015 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages225-228
Number of pages4
ISBN (Electronic)9781479983636
DOIs
Publication statusPublished - 30 Sept 2015
Event11th IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2015 - Singapore, Singapore
Duration: 1 Jun 20154 Jun 2015

Publication series

NameProceedings of the 2015 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2015

Conference

Conference11th IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2015
Country/TerritorySingapore
CitySingapore
Period1/06/154/06/15

Bibliographical note

Publisher Copyright:
© 2015 IEEE.

Keywords

  • Phase-change memory
  • non-volatile memory
  • resistive memory

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