Abstract
Despite the promise for resistive phase-change memory to be used in the BEOL memory integration, achieving low current programming and rapid thermal cycle management are still the main barriers in term of operation. In this work, different methods to reduce the programming current are examined with respect to their effects on thermal cycling during SET and RESET. In particular, the discussion will focus on the engineering of the electrode to phase-change material interface to achieve low programming current. Experimental demonstration and thermal simulation data are used to illustrate the concept and explain the device behaviors.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the 2015 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2015 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 225-228 |
| Number of pages | 4 |
| ISBN (Electronic) | 9781479983636 |
| DOIs | |
| Publication status | Published - 30 Sept 2015 |
| Event | 11th IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2015 - Singapore, Singapore Duration: 1 Jun 2015 → 4 Jun 2015 |
Publication series
| Name | Proceedings of the 2015 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2015 |
|---|
Conference
| Conference | 11th IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2015 |
|---|---|
| Country/Territory | Singapore |
| City | Singapore |
| Period | 1/06/15 → 4/06/15 |
Bibliographical note
Publisher Copyright:© 2015 IEEE.
Keywords
- Phase-change memory
- non-volatile memory
- resistive memory
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