Skip to main navigation Skip to search Skip to main content

Investigation of Sintering Characteristics of Composite Multilayer Metallization for MEMS Device Applications

  • Zhenan Tang
  • , Rajnish Kumar Sharma
  • , Yangyuan Wang
  • , Guizhen Yan
  • , Philip C.H. Chan
  • , I-Ming Hsing
  • , Johnny K.O. Sin

Research output: Contribution to conferenceConference Paperpeer-review

Abstract

This paper presents the characteristics of composite multilayer metallization after high temperature sintering for the purpose of fabricating integrated gas sensors. Several types of composite multilayer metal electrodes such as Au/Ti/Al/Ti-W (200/50/600/500nm), Au/Cr/Al/Ti-W (250/50/600/50nm), Au/Ti-W, Au/Ti, and Au/Pt/Ti or Pt/Ti were investigated. Spikes or hillocks on the surface of the composite multilayer metal electrodes after high temperature sintering are analyzed with microscopy and XPS. Based on this investigation, we have determined which multilayer metal system is most suitable for high temperature applications.
Original languageEnglish
Publication statusPublished - 2000
EventInternational Symposium on Smart Structures & Microsystems -
Duration: 1 Jan 20001 Jan 2000

Conference

ConferenceInternational Symposium on Smart Structures & Microsystems
Period1/01/001/01/00

Keywords

  • Composite multilayer metallization
  • High temperature sintering
  • Integrated gas sensors
  • Sintering

Fingerprint

Dive into the research topics of 'Investigation of Sintering Characteristics of Composite Multilayer Metallization for MEMS Device Applications'. Together they form a unique fingerprint.

Cite this